Shield– tag –
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TESA Unveils Innovative Adhesive Solutions to Meet Demands of Miniaturized and Complex Electronic Devices
TESA Germany Overview TESA is showcasing its innovative electronic adhesive solutions engineered for bonding, mounting, sealing, cushioning, shielding, and encapsulation in increasingly small and complex electronic devices. These solutio... -
TESA Revolutionizes Car Design and Assembly with Advanced Automotive Adhesives for EV Electrification and HMI Evolution
TESA Germany Overview TESA's advanced automotive adhesive solutions are crucial for the evolving car design and assembly, especially with the shift towards electric vehicles (EVs) and sophisticated human-machine interfaces (HMI). Their c... -
Epsilon Unveils Advanced Semiconductor Packaging Materials at ASPS 2026 for AI Data Centers: Die Attach Copper Paste Improves Thermal Dissipation and Reduces Cost
The Elec Inc. South Korea Overview Epsilon showcased advanced packaging material solutions at the 2026 Advanced Semiconductor Packaging & Chiplet Show (ASPS 2026), targeting advancements in AI data centers. Exhibited materials includ... -
Tinicum Acquires GracoRoberts, Bolstering Speciality Chemical Distribution for Aerospace & Defense Market
Middle Market Growth USA Overview Investment firm Tinicum has acquired GracoRoberts, a leading distributor of specialized chemicals and composite materials for the aerospace and defense markets, from CM Equity Partners. GracoRoberts supp... -
Electroninks and SIIX Scale Up Additive EMI Shielding Collaboration, Targeting Japan and Global Markets
EINPresswire.com USA, Japan Overview Electroninks and Japan's SIIX Corporation have expanded their strategic collaboration to advance additive electromagnetic interference (EMI) shielding solutions for diverse electronic applications, wi... -
Henkel Delivers Advanced Semiconductor Packaging Materials to Tackle Thermal and Mechanical Challenges in 2.5D/3D Packaging
Henkel Adhesives Germany Overview Henkel offers a diverse portfolio of advanced semiconductor packaging solutions, including lid and stiffener adhesives, EMI shielding, liquid compression molding solutions, and underfills. These material... -
Wacker Chemie Unveils ELASTOSIL® CM Series: Ceramifying Thermal Barriers for Enhanced EV Battery Safety During Thermal Runaway
Wacker Chemie AG Germany Overview Wacker Chemie AG will showcase its ELASTOSIL® CM series at The Battery Show Europe 2026, presenting innovative silicone technologies to significantly enhance EV battery safety. This series offers flexibl...
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