Dow Unveils TC-3120 High-Performance Thermal Gel for Data Centers: High Thermal Conductivity and Excellent Flowability to Address AI and Big Data Challenges

July 5, 2026

Assembtek USA

Overview

Dow has launched TC-3120, a high-performance thermal gel specifically engineered for thermal management in data center chips, servers, and high-speed optical modules (400G/800G). This thermal gel features exceptionally high thermal conductivity and excellent flowability, making it ideal for automated production processes. It is a crucial solution for addressing increased heat generation in the AI and Big Data era, resolving global data center bottlenecks.

In Depth

Key Findings: Dow Introduces High-Performance Thermal Gel TC-3120 to Address Data Center Challenges in the AI/Big Data Era

Dow, a global leader in chemistry and materials science, has announced TC-3120, a high-performance thermal gel designed to address thermal management challenges in data center chips, servers, and next-generation high-speed optical modules (400G/800G). This new product combines extremely high thermal conductivity with excellent flowability, contributing to resolving data center bottlenecks in high-heat environments driven by AI and Big Data.

Technical & Product Details

Exceptionally High Thermal Conductivity: TC-3120 boasts particularly high thermal conductivity within Dow’s product lineup. This property allows it to efficiently absorb and rapidly transfer large amounts of heat generated by high-performance processors and optical modules to the heatsink, thereby suppressing device temperature rise.
Excellent Flowability (Low Viscosity): Thermal gels must fill microscopic irregularities and voids on device surfaces upon application to maximize contact with the heat source. TC-3120’s superior flowability enables uniform application even to complex component geometries, making it particularly suitable for high-speed and high-precision dispensing in automated production lines.
Optimized for Data Centers: It is specifically designed for data center environments where high-heat-generating components such as 400G/800G high-speed optical modules, GPUs, and CPUs are densely packed, contributing to the stable operation and extended lifespan of these components.
High Reliability and Durability: The gel offers high reliability and durability, ensuring minimal degradation of thermal conduction performance and material integrity even under prolonged harsh operating conditions.

Background & Industry Context

The expansion of AI model training, big data analytics, and cloud computing is leading to a continuous increase in power consumption and heat generation within data centers year after year. Particularly in high-density servers and high-speed network equipment, efficient thermal management has become the biggest challenge for ensuring system stability and energy efficiency. Conventional thermal interface materials have struggled to keep pace, creating a strong demand for higher-performance solutions.

Strategic Significance & Outlook

Dow’s TC-3120 has the potential to establish a new standard for thermal management in AI-era data center infrastructure. This high-performance thermal gel will accelerate the development of next-generation AI accelerators and HPC systems, and contribute to reducing data center operating costs and improving sustainability. In the future, its application is also anticipated in other high-thermal-density areas, such as electric vehicles and 5G base stations.

Source: https://www.assembtek.com/blogs/knowledge-hub/global-data-center-challenges-dow-tc-3120-high-performance-thermal-gel-breaks-global-bottlenecks-for-ai-big-data-era

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