August 2026– date –
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Chase Corporation Acquires Hylomar Holdings Limited, Bolstering Presence in Specialty Sealants and Adhesives Markets for Industrial, Aerospace, and Electronics Sectors
Morningstar / PR Newswire USA Overview Chase Corporation, a global provider of engineered materials, has acquired Hylomar Holdings Limited, a designer and manufacturer of specialty sealants and adhesives. This acquisition significantly s... -
tesa Introduces ‘tesa 4563’ Adhesive Tape for Industrial Roller Wrapping, Combining Excellent Anti-Adhesion and Anti-Slip Properties for Printing and Web Processing Industries
openPR.com / ABNewswire Germany Overview tesa has launched 'tesa 4563,' a new adhesive tape specifically designed for industrial roller wrapping applications. This product features a specially treated fabric substrate and a silicone rubb... -
3M and BOE Establish Joint Lab to Accelerate Display Technology Innovation, Focusing on ‘Wrinkle-Free’ Foldable Display Reliability
3M News Center USA Overview 3M and BOE have opened a joint laboratory within the BOE Technology Innovation Center to accelerate display technology innovation. This collaborative R&D platform integrates BOE's display innovation with 3... -
China’s Top 5 Self-Adhesive PVC Film Manufacturers Drive Interior Decoration Innovation with Water-Based Acrylic Adhesive Technology for Furniture and Wall Surfaces
EIN Presswire China Overview Five leading Chinese self-adhesive PVC film manufacturers are revolutionizing the interior decoration market with innovative products for furniture and wall surfaces, leveraging advanced water-based acrylic p... -
Nordson Electronics Solutions Unveils ASYMTEK Vantage® XL Fluid Dispensing System for Panel-Level Packaging at SEMICON Taiwan 2026, Boosting Throughput and Yield for AI/HPC Chips
Morningstar / Nordson Electronics Solutions USA Overview Nordson Electronics Solutions launched the new ASYMTEK Vantage® XL fluid dispensing system at SEMICON Taiwan 2026, specifically engineered to meet the stringent demands of panel-le... -
DELO Unveils Ultra-Low Temperature Curing Adhesives for Consumer Electronics, Achieving Curing at 45°C for Enhanced Productivity and Component Protection
DELO News Germany Overview DELO has introduced a new generation of adhesives enabling ultra-low temperature (SLT) curing from just 45°C for consumer electronics assemblies, a significant reduction from conventional methods. Part of the D... -
Cyclomer Unveils ‘D-glue’ Debondable Adhesive, Drastically Improving Technical Plastic Recovery from Electronics through Heat Activation
Cyclomer / Recycling Today UK Overview A new heat-activated debondable adhesive, 'D-glue,' has been introduced, designed to lose adhesion upon heating, significantly enhancing the recovery of high-value technical plastics from end-of-lif... -
YINCAE Unveils UF 88UV Optical Underfill with Near 100% Transparency for Advanced Semiconductor Packaging, Enhancing Inspectability
openPR.com / YINCAE Advanced Materials, LLC USA Overview YINCAE Advanced Materials has launched UF 88UV, an innovative high-transparency optical underfill tailored for advanced semiconductor and optoelectronic packaging, boasting approxi... -
SK hynix’s MR-MUF and Samsung’s TC-NCF Revolutionize Thermal Management in AI Semiconductor HBM: Driving Advanced Packaging Evolution
USD Analytics Global Overview The evolution of AI is driving significant changes in semiconductor packaging and High Bandwidth Memory (HBM) technologies, with SK hynix's Advanced MR-MUF and Samsung's TC-NCF technologies solving critical ... -
AI Advancements Drive New Semiconductor Packaging Paradigm: Panel-Based Technologies Surpass Traditional Silicon Interposer Limits
Facebook (reposting an industry trend) USA Overview The rapid evolution of AI is pushing semiconductor packaging beyond the practical limits of traditional silicon interposers, driving a new paradigm. Panel-based packaging is emerging as...
