August 2026– date –
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AI-Optimized Sustainable P3HB:ZnO Composite Piezoelectric Nanofibers Outperform PVDF:ZnO for Advanced Gait Monitoring Systems
Academic Journal Overview High-performance poly(3-hydroxybutyrate):zinc oxide (P3HB:ZnO) composite piezoelectric nanofibers have been developed using an AI-driven artificial neural network-genetic algorithm framework. This novel sustaina... -
Dual-Mode Thermoelectric-Piezoelectric Flexible Sensor Developed Using PEDOT/PSS-Coated 3D Spacer Fabric for Self-Powered Wearable Applications
ACS Publications USA Overview Researchers have developed a novel 3D flexible sensing unit by coating PEDOT/PSS onto PVDF spacer filaments within a warp-knitted spacer fabric. This dual-mode sensor uniquely combines both thermoelectric an... -
MIT Unveils Mathematical Framework for 3D Printing Bio-Inspired Adaptive Materials, Accelerating Soft Robotics and Morphing Aircraft Wing Design
MIT News | Massachusetts Institute of Technology USA Overview MIT researchers have developed a pioneering mathematical framework for designing bio-inspired adaptive materials, with direct applications in soft robotics and morphing aircra... -
DELO Introduces DUALBOND LT Series: Next-Gen Ultra-Low Temperature Curing Adhesives for Consumer Electronics, Curing at 45°C
SMT Today Germany Overview DELO has launched a new generation of super low temperature (SLT) curing adhesives, part of its DUALBOND LT family, specifically for consumer electronics assembly. These innovative adhesives achieve reliable bo... -
Adhesives and Sealants Market to Hit $122.42B by 2033; DELO Launches 62% Bio-Based Automotive Adhesive
Kings Research International Overview The global adhesives and sealants market is projected to expand to $122.42 billion by 2033, driven by vehicle electrification, lightweighting, and sustainability demands. In July 2026, DELO Industria... -
Panacol Unveils Next-Gen UV Adhesives for Medical Devices, Elevating Biocompatibility and Sterilization Resistance
Panacol-Elosol GmbH News Germany Overview Panacol has launched a new series of UV-curable adhesives specifically engineered for medical device assembly, boasting significantly enhanced biocompatibility and robust sterilization resistance... -
Ajinomoto Fine-Techno’s ABF Breakthrough Powers Next-Gen AI: Enhanced Dielectrics and Reduced CTE Critical for Advanced Packaging
Ajinomoto Fine-Techno Investor Relations Japan Overview Ajinomoto Fine-Techno has announced a significant evolution of its Ajinomoto Build-up Film (ABF) technology, specifically engineered to meet the rigorous packaging demands of next-g... -
3M Launches Fast-Curing Acrylic Adhesive for Multi-Material Bonding to Lightweight EV Body Structures
3M（3M Automotive Solutions News） USA Overview 3M has announced a new high-strength acrylic adhesive formulated for multi-material bonding in electric vehicle (EV) body structures. This adhesive enables reliable joining of dissimilar ma... -
Wacker Unveils Advanced Silicone Encapsulant for Automotive Power Modules, Promising Unprecedented Durability and Safety for EVs
Wacker Chemie AG Press Release Germany Overview Wacker has introduced an innovative silicone encapsulant designed specifically for automotive power modules, offering superior protection against moisture, vibration, and extreme temperatur... -
Indium Corporation Unleashes Low-Temperature Silver Sintering Paste to Propel GaN Power Device Evolution
Indium Corporation USA Overview Indium Corporation has launched a novel low-temperature silver sintering paste specifically designed for Gallium Nitride (GaN) power devices. This advanced material enables high-reliability die attachment ...
