August 2026– date –
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imec Revolutionizes Sensing and Imaging with Integrated Photonics Breakthroughs at SPIE Optics + Photonics 2026: CMOS-Compatible SWIR and Real-Time Scattering Compensation
imec Belgium Overview At SPIE Optics and Photonics 2026, imec presented two major integrated photonics advancements. Gökhan Kara unveiled a CMOS-compatible platform for cost-effective SWIR spectral sensing, while Filip Milojković introdu... -
Socionext Expands SoC Roadmap with Intel 18A-P Process, Bolstering Next-Gen Opto-Electronic Device Integration
Design And Reuse Japan Overview Socionext has broadened its System-on-Chip (SoC) roadmap by adopting Intel's advanced 18A-P process technology. This strategic move strengthens the foundation for supporting complex integration required fo... -
Semiconductor Foundries Evolve Role, Driving Industrialization of Silicon Photonics and Advanced Heterogeneous Integration
Design And Reuse USA Overview Semiconductor foundries are shifting their role from pure transistor manufacturing to providing advanced packaging and heterogeneous integration solutions. This evolution is crucial for the burgeoning chiple... -
TIER IV and Renesas Partner to Develop AI-Native Software-Defined Vehicle Platform, Integrating Advanced Sensing and Photonic Computing
Design And Reuse Japan Overview Japanese autonomous driving firm TIER IV and semiconductor giant Renesas Electronics have announced a partnership to co-develop an AI-native Software-Defined Vehicle (SDV) platform. This collaboration aims... -
Arteris Reports High Premium for AI Chip IP, Reflecting Soaring Demand for Specialized Silicon
Design And Reuse USA Overview Arteris has observed a significant premium for AI chip intellectual property (IP) in the market, underscoring the escalating value of specialized IP in AI hardware development. Semiconductor manufacturers ar... -
Alibaba Develops RISC-V Chip Capable of Running 27 Billion Parameter AI Model Without GPU
Design And Reuse China Overview Alibaba has developed a RISC-V-based chip that can execute a 27 billion parameter AI model without relying on a GPU. This achievement signals significant progress in specialized alternative chip architectu... -
Rapidus Targets 8-Reticle Interposers on 600mm Advanced Packaging Panels by 2030, Accelerating Heterogeneous Integration for AI/HPC
Design And Reuse Japan Overview Japanese foundry Rapidus has unveiled an ambitious roadmap to achieve 8-reticle interposers on 600mm advanced packaging panels by 2030. This development is crucial for integrating complex chiplets, includi... -
TSMC Completes 1.6nm A16 Process Development, Targets Q4 Mass Production for Next-Gen AI/HPC Chips
Design And Reuse Taiwan Overview TSMC has successfully completed development of its 1.6nm A16 process technology, with mass production scheduled for Q4. This cutting-edge process is foundational for next-generation high-performance compu... -
Shanghai Jiao Tong University Develops FOWLP for Seamless Opto-Electronic Integration, Halving Signal Loss in Data Centers
IMAPS 3D InCites Content Platform China Overview Researchers at Shanghai Jiao Tong University have pioneered a fan-out wafer-level packaging (FOWLP) technique to integrate electronic and photonic components, significantly reducing signal... -
Ciena Gains Focus with e& UAE Network Deal, Deploying WaveLogic Coherent Optical Technology for High-Capacity Regional Networks
Kalkine Media USA Overview Ciena is drawing significant attention with its e& UAE (formerly Etisalat UAE) network deployment, providing integrated solutions including advanced optical hardware, coherent technology, and network contro...
