Key Findings
Linktel Technologies showcased its 1.6T LPO solutions, specifically the 1.6T LPO 2DR4, at the 2026 OCP Global Summit. These modules are designed for next-generation AI computing networks, focusing on reducing power loads and signal processing delays. The company confirmed that volume production for these 1.6T connectivity solutions is already in place.
Technical Details
The 1.6T LPO architecture provides several technical advantages for high-performance AI scale-out fabrics:
- Power Efficiency: Operates with power consumption as low as 10W.
- Latency: Utilizes a linear optics architecture to minimize signal processing delays.
- Supply Chain: Removes the optical DSP to eliminate component choke points.
- Interoperability: Validated multi-switch platform interoperability during the 1.6T LPO-MSA Plugfest in early September 2026, supporting the 200G-per-wavelength ecosystem.
Other Architectural Innovations
Beyond LPO, Linktel presented additional high-speed connectivity pillars:
- 12.8T Liquid-Cooled XPO: Integrated with advanced liquid cooling for high-density AI nodes. As a founding member of the XPO MSA, Linktel is scaling XPO series variants including FRO, LRO, and LPO.
- 6.4T/7.2T NPO Modules: Supports both ELS and ILS configurations, combining high density with low power and latency.
- DMD Technology: Dr. Grace Zhang presented Dispersion Managed Transceivers for OCS SuperPOD architectures, specifically cost-effective 800G (20km) and 1.6T (10km) solutions, and the feasibility of 400G per lambda (3km).
Significance and Outlook
The DMD product line has entered volume production. To accelerate the maturity of next-gen AI fabrics, Linktel has stated it is open to sharing its U.S.-filed patents with ecosystem partners. These developments target the scaling pressures of AI data centers that require higher bandwidth densities within strict thermal and power budgets.
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