2026– date –
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H.B. Fuller Confirms Unsolicited $1.1-$1.2 Billion Acquisition Bid for Building Adhesive Solutions Unit from Ancora
PCI Magazine USA Overview H.B. Fuller has confirmed receipt of an unsolicited, non-binding proposal from Ancora Holdings Group to acquire its Building Adhesive Solutions (BAS) business for $1.1 to $1.2 billion in cash. The company's boar... -
UC Berkeley Joins Applied Materials’ EPIC Center to Accelerate Chip Innovation, Focusing on Advanced Packaging and Materials R&D
Stock Titan USA Overview UC Berkeley is partnering with Applied Materials' EPIC Center to accelerate chip innovation through enhanced R&D collaboration and talent development. This partnership will concentrate on advancing semiconduc... -
Lam Research to Invest Over $3 Billion in Global Lab Expansion, Accelerating Advanced Packaging for AI Era
Lam Research USA Overview Lam Research announced plans to invest over $3 billion in expanding its global lab network to significantly increase innovation velocity for the AI era. This substantial investment is aimed at accelerating produ... -
Henkel’s LOCTITE HB XE Adhesives Propel High-Rise Timber Construction, Meeting EUROCODE 5 Standards
Henkel Germany Overview Henkel Adhesive Technologies is set to revolutionize mass timber construction with its innovative LOCTITE HB XE fire-retardant polyurethane adhesive line, launching in 2025. Building on the success of LOCTITE HB X... -
Fraunhofer IAP Unveils Next-Gen Display Materials and Room-Temperature Pressure-Activated Microencapsulated Adhesives for Enhanced Industrial Safety
Fraunhofer Institute for Applied Polymer Research (IAP) Germany Overview Fraunhofer IAP presented research on next-generation display materials at IMID 2026 and is developing microencapsulated adhesives to simplify industrial bonding pro... -
Indium Corporation Unveils Next-Gen Copper Sintering Paste for High-Power Semiconductors, Achieving Gold/Silver-Free High Reliability Die-Attach
Indium Corporation USA Overview Indium Corporation presented a next-generation copper sintering paste for high-power semiconductor applications at ICEPT 2026. This innovative paste provides high reliability, exceptional thermal and elect... -
Fraunhofer IFAM Drives High-Performance Adhesive and Sealant Innovation for Electromobility: Revolutionizing Battery Modules and Fuel Cells
Fraunhofer-Gesellschaft Germany Overview Fraunhofer IFAM is actively developing adhesive bonding technologies for electromobility, focusing on thermally and electrically conductive joints in battery modules. The institute's research enco... -
Solvent-Free Modified Cyanate Ester Resin Achieves 105.7% Impact Strength Increase and 13.5 MPa Shear Strength at 250 °C
ACS Publications (Industrial & Engineering Chemistry Research) Unknown Overview A study published in Industrial & Engineering Chemistry Research introduces a novel synergistic toughening strategy for solvent-free modified cyanate est... -
Intel Partners with Lens Technology to Revolutionize Advanced Semiconductor Packaging for AI Era
Storage Newsletter USA Overview Intel has announced a strategic collaboration with Lens Technology, leveraging its expertise in glass materials, high-precision laser processing, and advanced manufacturing. This partnership is designed to... -
H.B. Fuller’s Proposed Acquisition of Advanced Medical Solutions Group Approved by Shareholders, Fortifying Healthcare Platform
Morningstar USA Overview H.B. Fuller Company announced that Advanced Medical Solutions Group plc (AMS) shareholders have approved its acquisition proposal. This strategic integration aims to combine AMS's medical technologies and regulat...
