Samsung Delays Hybrid Bonding HBM Mass Production to 2029-2030, Aligning with Technical Challenges and NVIDIA’s Next-Gen GPUs

July 26, 2026

TrendForce South Korea

Overview

Samsung Electronics is reportedly delaying the full-scale mass production of its hybrid bonding technology for next-generation HBM and logic semiconductors until 2029-2030. The company is currently building a mass production line at its Pyeongtaek campus with approximately 50 die-to-wafer (D2W) hybrid bonders, with equipment delivery expected by late 2026. This delay is attributed to the significant technical challenges associated with transitioning to hybrid bonding, which eliminates microbumps for improved signal quality, reduced power consumption, and higher-density designs, potentially coinciding with NVIDIA’s upcoming Feynman AI GPUs.

In Depth

Key Findings

Samsung Electronics is reportedly pushing back the full-scale mass production of its hybrid bonding technology for next-generation High-Bandwidth Memory (HBM) and logic semiconductors until 2029-2030. This delay highlights the significant technical complexities involved in transitioning to this advanced packaging method, as well as the strategic alignment with market readiness for future AI platforms, potentially coinciding with NVIDIA’s next-generation GPUs.

Technical & Manufacturing Details

Samsung is in the process of establishing a mass production line at its Pyeongtaek campus, which will be equipped with approximately 50 die-to-wafer (D2W) hybrid bonders, reportedly sourced from Dutch firm BE Semiconductor Industries (Besi). Hybrid bonding represents a significant leap forward in HBM manufacturing by eliminating the need for traditional microbumps, thereby allowing for much closer stacking of chip layers. This reduction in inter-layer spacing leads to substantial improvements in signal integrity, lower power consumption, and enables significantly higher memory density designs.

However, the commercialization of this innovative technology presents several hurdles. Specifically, it necessitates extensive modifications to existing manufacturing equipment, the introduction of novel materials, the development of rigorous testing processes, and a fundamental overhaul of production methodologies. Samsung requires additional time to overcome these technical challenges, pushing full-scale commercial deployment a few years further. This timeline may strategically align with the anticipated launch of NVIDIA’s next-generation AI GPU, codenamed “Feynman,” suggesting that Samsung’s hybrid bonding HBM will be available to meet the demands of future high-performance AI platforms.

**Die-to-Wafer (D2W) Bonding:** Technology to directly bond individual chips to a wafer, enabling finer connections and higher integration density.
**Micro-bump Less:** Eliminates traditional microbumps, significantly reducing inter-layer distance for improved electrical characteristics.
**HBM Evolution:** Facilitates the development of higher-performance and more power-efficient HBM products, including customized HBM (cHBM).

Background & Context

The relentless evolution of AI and high-performance computing (HPC) demands unprecedented bandwidth and capacity from semiconductor memory. HBM is a leading technology addressing these demands, but further performance enhancements require innovations in chip stacking. Hybrid bonding is widely recognized as the next frontier for HBM performance, attracting significant industry attention. Competitors like SK hynix are also heavily invested in developing this technology, underscoring the fierce competition and the critical importance of technological innovation within the HBM market.

Strategic Significance & Outlook

Samsung’s reported delay in hybrid bonding HBM mass production to 2029-2030 highlights the complexity of this technology and the broader industry challenges in technological transition. Nevertheless, this investment is a crucial step for Samsung to maintain its competitive edge in the future AI chip market. Successful collaboration with key customers like NVIDIA could solidify Samsung’s position as a leading HBM supplier for next-generation AI infrastructure. In the long term, hybrid bonding is expected to fundamentally transform semiconductor manufacturing efficiency and performance, serving as a cornerstone for further advancements in AI technology.

Source: https://www.trendforce.com/news/2026/07/22/news-samsung-reportedly-builds-hybrid-bonding-mass-production-line-full-scale-deployment-seen-in-2029-2030/

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