Key Findings
Indium Corporation announced it will showcase high-reliability packaging material solutions for next-generation power electronics at PCIM Asia 2026. Featured products include InFORCE®MF pressure silver sintering paste for silicon carbide (SiC) die-attach and InBAKE™29 copper sintering paste for power discrete die-attach. These materials are engineered to deliver exceptional die shear strength, thermal conductivity, and mechanical robustness, enabling highly efficient and reliable manufacturing processes for advanced power devices.
Technical & Product Details
- InFORCE®MF Pressure Silver Sintering Paste: This paste is specifically developed for SiC-based power devices, offering high thermal conductivity and strong die shear performance. It supports a pressure-applied sintering process, creating dense, void-free bonds critical for maintaining device reliability under high operating temperatures. This technology is vital for the longevity and performance of high-power SiC modules.
- InBAKE™29 Copper Sintering Paste: Designed for power discrete devices, this innovative copper sintering paste provides excellent thermal and electrical conductivity without requiring gold or silver plating on the die. It is compatible with pressureless batch oven sintering, which simplifies manufacturing processes and reduces production costs. InBAKE™29 effectively addresses the rigorous thermal management demands of wide-bandgap semiconductors like SiC and GaN.
- Shared Advantages: Both materials exhibit high resistance to thermal and mechanical stresses, ensuring stable device operation over extended periods. Their optimized cure profiles also contribute to increased manufacturing throughput and overall system efficiency, which are crucial for rapidly expanding markets.
Background & Context
The escalating demand for power electronics in applications such as electric vehicles (EVs), renewable energy systems, and industrial motor drives necessitates higher power density, greater efficiency, and enhanced reliability. The adoption of next-generation semiconductor materials like SiC and gallium nitride (GaN) requires advanced die-attach solutions that can effectively manage heat and ensure robust interconnections. Indium Corporation’s new sintering pastes are direct responses to these industry demands, contributing significantly to thermal management and extending device lifespan.
Strategic Significance & Outlook
Indium Corporation aims to continue supporting technological innovation in the power electronics industry through these cutting-edge materials. The advancements in SiC and copper sintering technologies are expected to enable the development of smaller, more efficient power modules, playing a critical role in extending EV range and improving the efficiency of renewable energy infrastructure. The company plans to continue its robust R&D efforts to meet the evolving needs of the high-growth power electronics market.
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