TRUMPF Resolves Glass Substrate TGV Coating Bottleneck with High-Power HiPIMS, Accelerating Next-Gen AI Chip Packaging

September 6, 2026

TRUMPF Germany

Overview

TRUMPF has introduced a High-Power Impulse Magnetron Sputtering (HiPIMS) approach to address a key manufacturing challenge in next-generation AI chip packaging: reliably coating millions of minute Through-Glass Vias (TGVs) in glass substrates. This HiPIMS technology facilitates the formation of more uniform conductive coatings inside the deep, narrow holes of glass substrates. Glass is gaining attention as an advanced packaging material for its ability to support high-density interconnects and fast, efficient data transmission, with TRUMPF’s innovation accelerating its practical application.

In Depth

Key Findings

TRUMPF has presented a groundbreaking solution to a major manufacturing challenge in next-generation AI chip packaging, specifically the reliable and uniform coating of millions of minute Through-Glass Vias (TGVs) in glass substrates. The company’s introduction of a High-Power Impulse Magnetron Sputtering (HiPIMS) approach enables the formation of more uniform and high-quality conductive coatings inside the deep, narrow holes of glass substrates. This innovation effectively removes a critical bottleneck for the commercialization of glass substrates, thereby accelerating the realization of advanced packaging for AI and High-Performance Computing (HPC) chips.

Technical & Clinical Details

Glass substrates are considered an ideal material for next-generation AI chip packaging due to their advantageous properties compared to traditional organic substrates, including a coefficient of thermal expansion (CTE) close to silicon, high dimensional stability, excellent electrical characteristics (low dielectric loss), and fine processability. These features enable the creation of finer line width/space (L/S) wiring and high-density Through-Glass Vias (TGVs). TGVs are minute electrical interconnections that pass through the glass substrate, facilitating high-speed, low-latency data transmission between chiplets and HBM (High Bandwidth Memory).

However, a significant technical hurdle in their manufacturing process has been the challenge of forming millions of TGVs and uniformly depositing conductive layers on their inner walls. Non-uniform TGV coatings can lead to variations in electrical resistance and reduced reliability, negatively impacting the final package performance.

TRUMPF’s HiPIMS technology generates a high-density, high-energy plasma, allowing sputtered particles from the target material to reach deep and uniformly into the TGV interiors on the substrate. This ensures the deposition of high-quality conductive layers, such as copper, on the sidewalls and bottoms of the TGVs, securing reliable electrical connections. This precise deposition capability directly translates into improved yields and performance stability for complex AI packages that integrate more chiplets and HBM.

Background & Context

The explosive growth of AI is driving structural changes in the semiconductor industry, making packaging technology a critical factor in determining overall system performance, beyond just processor advancements. The strain on TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) capacity and the HBM supply shortage have accelerated demand for new advanced packaging materials like glass substrates. Leading companies such as Intel, TSMC, and Samsung Electro-Mechanics are heavily investing in glass substrate R&D, eagerly anticipating its commercialization. TRUMPF’s HiPIMS technology breaks through a key technological barrier in glass substrate manufacturing, playing a crucial role in promoting innovation across the entire supply chain and accelerating the market entry of AI chips.

Strategic Significance & Outlook

The introduction of HiPIMS technology by TRUMPF significantly paves the way for glass substrates to become a mainstream solution in next-generation AI chip packaging. This technological advancement is expected to improve mass production costs and yields for glass substrates, accelerating their full-scale commercialization, which is projected to occur from 2028 onwards. Increased adoption of glass substrates will lead to even higher performance and integration levels for AI chips, enabling more complex AI models and new applications. Innovations from equipment manufacturers like TRUMPF are crucial for strengthening the entire semiconductor manufacturing supply chain’s technological ecosystem and supporting the exponential increase in computing power during the AI era.

Source: https://technode.global/2026/09/03/trumpf-glass-substrates-ai-chip-packaging-hipims/

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