Indium Corporation Showcases High Thermal Conductivity TIMs and Sintering Pastes for AI at SEMICON Taiwan

September 6, 2026

Indium Corporation USA

Overview

Indium Corporation exhibited innovative materials supporting AI technology at SEMICON Taiwan, highlighting Heat-Spring® compressible metal TIMs and solder TIMs for superior thermal conductivity in high-power-density devices. The company also introduced InFORCE®MF pressure Ag sintering paste for SiC die attach and InFORCE®29 pressure Cu sintering paste for high-reliability applications, alongside WS-910 flip-chip flux. These advancements underscore Indium Corporation’s commitment to sustainable and energy-efficient solutions for semiconductor packaging, addressing critical thermal challenges in next-gen electronics.

In Depth

Key Findings

Indium Corporation presented a suite of innovative material solutions at SEMICON Taiwan, designed to enable advancements in Artificial Intelligence (AI) technology. Prominently featured were their Heat-Spring® compressible metal Thermal Interface Materials (TIMs) and solder TIMs, which significantly enhance thermal management capabilities in high-power-density devices. The company also showcased advanced pressure sintering pastes for silicon carbide (SiC) and GaN power devices, clearly demonstrating their contribution to improving the performance and reliability of next-generation semiconductor packaging.

Technical / Clinical Details

The core of Indium Corporation’s exhibition focused on materials that improve heat dissipation performance, a critical requirement for AI accelerators and High-Performance Computing (HPC) devices. The Heat-Spring® compressible metal TIMs offer exceptional thermal conductivity, reducing thermal resistance between the die and heatsink. Solder TIMs provide long-term stable thermal performance, especially crucial in high-power-density applications.

Heat-Spring® Compressible Metal TIMs: These materials offer superior thermal conductivity, enabling efficient heat transfer by filling gaps within the package. They are optimized for TIM2 applications, specifically the thermal path between the heat spreader and the main heatsink.
Solder TIMs: Provide high thermal conductivity and long-term reliability, supporting stable operation in high-power-density devices.
InFORCE®MF Pressure Ag Sintering Paste: Developed for SiC power semiconductor die attach, this paste achieves higher thermal conductivity, reliability, and high-temperature resistance compared to traditional solders. It forms strong, void-free bonds by sintering silver particles at low temperatures and pressures.
InFORCE®29 Pressure Cu Sintering Paste: Targeted at high-reliability and high-thermal-conductivity applications, it leverages the excellent properties of copper for superior heat dissipation.
WS-910 Flip-Chip Flux: Designed for compatibility with both molded underfill and capillary underfill processes, contributing to improved yield and reliability in flip-chip assembly.

These materials aim to provide sustainable and energy-efficient solutions for semiconductor packaging and assembly, contributing to maintaining device performance and extending product lifespan in high-thermal-load environments.

Background & Context

With the evolution of AI and HPC, the power consumption and heat generation of semiconductor chips are continuously increasing. This makes efficient thermal management a paramount challenge for maximizing device performance and ensuring stable system operation. Furthermore, tightening environmental regulations and growing sustainability awareness demand increased energy efficiency and reduced environmental impact in semiconductor manufacturing processes. Material suppliers like Indium Corporation play a crucial role in supporting the development of the semiconductor ecosystem by providing innovative solutions that address these industry trends.

Strategic Significance & Outlook

The material technologies showcased by Indium Corporation will play an indispensable role in markets requiring high power density and performance, such as next-generation AI accelerators, data centers, and power electronics for electric vehicles (EVs). These innovative TIMs and sintering pastes are expected to resolve thermal bottlenecks in devices, directly contributing to further advancements in AI computing power, improved energy efficiency, and enhanced long-term reliability of end products. The company is anticipated to continue expanding the frontiers of material technology in the semiconductor packaging sector.

Source: https://www.indium.com/blog/indium-corporation-to-showcase-innovative-materials-enabling-ai-technology-at-semicon-taiwan/

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