Background: Evolution of Semiconductor Packaging and PFAS Regulatory Landscape
Modern semiconductor devices relentlessly pursue higher performance, greater integration, and lower power consumption, necessitating advanced packaging technologies. Insulation materials, crucial for protecting inter-chip wiring and providing electrical insulation, directly impact device reliability and performance. Per- and polyfluoroalkyl substances (PFAS) have historically been widely used in many semiconductor materials due to their excellent electrical and thermal properties. However, growing concerns about their environmental persistence and potential health impacts have led to tightening global regulations, making the transition to PFAS-free materials an urgent priority for the industry.
Key Findings: Fujifilm’s PFAS-Free PBO “ZEMATES™”
Fujifilm has announced that it will present its latest advanced packaging research findings and exhibit its “PFAS-free PBO (polybenzoxazole)” from the ZEMATES™ product line at the Electronic Components and Technology Conference (ECTC 2026), held from May 26-29 in Orlando, Florida. The ZEMATES™ series comprises photosensitive insulating materials used as insulation layers across a broad range of semiconductor packaging processes, from power semiconductors to high-performance AI semiconductors. Fujifilm has developed a proprietary PBO formulation that is entirely independent of PFAS-containing raw materials. This represents a significant strategic initiative to address both escalating environmental regulations and strong customer demand for PFAS-free materials. The new PFAS-free PBO retains the excellent electrical properties, thermal stability, and mechanical strength of conventional PBO while significantly reducing environmental impact.
Technical Significance and Outlook
Fujifilm’s development of PFAS-free PBO will substantially contribute to reducing the environmental footprint and enhancing supply chain sustainability in the semiconductor industry. This technology provides a critical solution for semiconductor manufacturers to develop high-performance, next-generation devices while complying with environmental regulations. The transition to PFAS-free materials is not merely about regulatory compliance; it also enhances corporate brand value and builds consumer trust. In the future, the application of this PFAS-free technology across a wider range of semiconductor materials is expected to significantly reduce the overall environmental footprint of the industry. Fujifilm is poised to contribute to both a sustainable society and high-performance electronics through innovation in materials technology.
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