Key Findings
Krayden is supplying LINQSOL EMC-7535, a low-stress, high-performance green epoxy molding compound (EMC) specifically designed for high-voltage and high-power semiconductor devices. This innovative material meets the stringent requirements of advanced packaging, significantly enhancing device reliability and durability.
Technical Details
Key technical features of LINQSOL EMC-7535 include:
- Low Modulus, Low Stress: Its low modulus effectively mitigates mechanical stresses arising from coefficient of thermal expansion (CTE) mismatches between the semiconductor chip and the package. This reduces the risk of chip damage and wire bond failures, improving device reliability.
- High Glass Transition Temperature (Tg): Boasting a high Tg of 175 °C, the material maintains its mechanical stability and properties even in high-temperature environments, which is essential for stable operation of high-power devices.
- Minimal Moisture Absorption: Extremely low moisture absorption prevents degradation of electrical properties and reliability due to moisture ingress into the package. This is particularly beneficial for device stability in high-humidity conditions.
- High Comparative Tracking Index (CTI): A high CTI value of 600 V indicates excellent resistance to surface discharge (tracking) under high voltage, ensuring electrical insulation safety.
- UL 94 V-0 Flammability Rating: Achieved the highest class of flammability rating, UL 94 V-0, guaranteeing safety in the event of fire.
- Superior Reliability: The combination of these properties ensures LINQSOL EMC-7535 delivers long-term reliability and robust performance for high-power semiconductor devices.
This EMC is ideal for encapsulating high-power devices such as power modules, IGBTs, and MOSFETs.
Background & Context
Demand for high-voltage and high-power semiconductors is rapidly expanding in sectors like electric vehicles (EVs), renewable energy systems, and industrial power supplies. While these devices are becoming more efficient and miniaturized, they also generate more heat and operate in increasingly harsh environments. This necessitates packaging materials that offer levels of thermal management, mechanical stress relief, electrical insulation, and reliability that are challenging to achieve with conventional materials. LINQSOL EMC-7535 has been developed to meet these escalating market demands, serving as a critical material to enable the commercialization of next-generation high-power devices.
Strategic Significance & Outlook
Krayden’s LINQSOL EMC-7535 has the potential to establish new benchmarks for reliability and safety in the high-voltage and high-power semiconductor market. Its adoption is particularly anticipated in rapidly growing sectors such as EV inverters, charging infrastructure, and solar power systems. This material not only contributes to improved device performance and extended lifespan but also facilitates compliance with stringent safety regulations. Moving forward, designers and manufacturers of high-power semiconductors can proactively adopt advanced EMCs like LINQSOL EMC-7535 to enhance their product competitiveness.
Source: https://www.krayden.com/products/linqsol-emc-7535
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