Samsung Dedicates Half of Its 4nm Foundry Capacity to HBM4 Base Dies Amid AI Boom

September 13, 2026

ZDNet Korea South Korea

Overview

Samsung Electronics is reportedly allocating over 50% of its advanced 4nm foundry capacity—specifically 15,000 wafers per month out of an estimated 30,000 total—to the production of HBM4 base dies. This strategic move, leveraging its Pyeongtaek S5 and S6 lines, aims to address the severe HBM supply shortage, which has become a critical bottleneck for high-performance AI accelerator production. The decision underscores Samsung’s intent to strengthen its position in the rapidly expanding AI semiconductor market and alleviate supply chain pressures for key customers.

In Depth

Background: AI Demand Reshapes Foundry Priorities

The artificial intelligence (AI) revolution has triggered an unprecedented shift in demand within the semiconductor industry, particularly in the foundry market. Beyond traditional general-purpose logic chips and mobile SoCs, there’s been a surge in demand for specialized components like High Bandwidth Memory (HBM) base dies and advanced packaging solutions such as CoWoS, which form the core of modern AI accelerators. As a result, foundry companies are increasingly compelled to allocate their limited advanced process capacity to strategically important and more profitable AI-related components.

Key Findings: Samsung Dedicates Half of 4nm Capacity to HBM4 Base Dies

Samsung Electronics is reportedly dedicating over 50% of its state-of-the-art 4nm manufacturing capacity to the production of HBM4 chip base dies. This strategic decision directly responds to a severe market condition where HBM demand significantly outstrips supply, acting as a critical bottleneck for next-generation AI accelerators. This aggressive production shift is a core strategy to mitigate the HBM4 supply shortage and to maintain and strengthen Samsung’s competitiveness in the rapidly evolving AI semiconductor market. Specifically, the advanced foundry lines S5 and S6 at its Pyeongtaek campus are being utilized for this high-priority HBM4 base die manufacturing.

Technical & Production Details

Massive Capacity Shift: Samsung Electronics’ total 4nm process foundry capacity is reportedly around 30,000 wafers per month. Out of this, approximately 15,000 wafers are specifically allocated for HBM4 base die manufacturing. This significant allocation means half of Samsung’s advanced process production resources are concentrated on a single, strategically vital product, underscoring the high priority placed on HBM.
Role of the HBM4 Base Die: HBM architecture involves multiple DRAM chips stacked vertically atop a base die, which is essentially a logic chip. This base die is crucial, housing the memory controller, testing functions, and the interface that connects to the GPU via Through Silicon Vias (TSVs). Manufacturing this component on a cutting-edge 4nm process is vital for maximizing HBM4’s power efficiency, optimizing data processing capabilities, and overall dictating the performance of the HBM stack.
Alleviating AI Chip Supply Bottleneck: The availability of HBM has emerged as one of the primary bottlenecks in the production of high-performance AI accelerators. Samsung’s substantial investment in HBM4 base die production aims to ease this critical supply constraint and stabilize the provision of HBM4 to key customers, including industry leaders like NVIDIA and AMD.

Strategic Implications & Outlook

This significant production shift by Samsung Electronics is expected to intensify the competitive landscape for dominance in the burgeoning HBM market, particularly against rival SK Hynix. By committing a substantial portion of its 4nm capacity to HBM4, Samsung aims to significantly increase its HBM product supply and establish a crucial technological advantage. This heightened competition is anticipated to drive further innovation and efficiency improvements in HBM technology, ultimately contributing to the overall advancement of AI infrastructure. Furthermore, this move underscores the increasing strategic value of foundries and the paramount importance of advanced packaging solutions within the entire semiconductor supply chain as AI continues to reshape the industry.

Source: https://wccftech.com/report-samsungs-4nm-lines-run-at-full-tilt-as-hbm4-chips-eat-up-to-60-of-foundry-output/

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