BESI Hybrid Bonding System Orders Exceed 150 Units, HBM5 Onward to Accelerate Memory Adoption

September 20, 2026

PhotonCap Unknown

Overview

BESI has secured over 150 cumulative orders for its hybrid bonding systems, with six integrated production lines (including 30 BESI bonders) implemented by major logic customers in partnership with Applied Materials. Currently deployed primarily for logic and Co-packaged Optics (CPO), this technology is expected to see memory adoption, specifically for HBM5 (20-layer stacking) and beyond, after HBM4E continues with existing methods, anticipating a three-year delay in memory sector penetration. This trend underscores the increasing criticality of hybrid bonding in advanced packaging.

In Depth

Key Findings

BE Semiconductor Industries (BESI) has reported over 150 cumulative orders for its innovative hybrid bonding systems, signaling robust market demand and expanding adoption within advanced packaging technologies. Notably, six integrated production lines, developed in collaboration with Applied Materials and incorporating 30 BESI bonders, have been deployed at key logic semiconductor customers.

Technical / Clinical Details

Hybrid bonding is a direct copper-to-copper bonding technology that operates without heat or pressure, enabling ultra-fine pitch connections and superior signal transmission characteristics. This technique is currently vital for manufacturing high-performance logic chips and Co-packaged Optics (CPO) devices, playing a crucial role in chiplet technology and 3D stacking. CPO, by integrating optical modules and semiconductors into a single package, promises significant improvements in data center bandwidth and power efficiency.

However, the adoption of hybrid bonding in the memory sector is occurring with a time lag. For High Bandwidth Memory (HBM), existing methods like wire bonding and micro-bump-based flip-chip bonding are projected to remain dominant until the HBM4E generation. Full-scale adoption of hybrid bonding for memory is anticipated from HBM5 (20-layer stacking) onward, with an estimated three-year delay compared to logic applications. This delay is attributed to the complex stacking structures and manufacturing processes inherent in memory chips.

Background & Context

The explosive demand for AI and High-Performance Computing (HPC) necessitates continuous advancements in semiconductor chip performance and miniaturization. To meet these demands, advanced packaging technologies, which integrate chips vertically and horizontally, have become a primary driving force in the semiconductor industry. Hybrid bonding is gaining prominence as a key enabler for next-generation 3D-ICs and chiplet integration, offering higher connection density and superior electrical performance compared to conventional thermocompression bonding.

Strategic Significance & Outlook

BESI’s strong order book for hybrid bonding systems confirms the technology’s indispensable role in future semiconductor manufacturing. Despite the delay in memory applications, with HBM5 onwards projected for adoption, hybrid bonding is expected to expand its reach across logic, CPO, and memory segments in the coming years. This will enable semiconductor manufacturers to achieve further performance enhancements and form factor reductions, thereby accelerating the evolution of the AI and HPC markets.

Source: https://photoncap.net/p/investment-map-22-listed-companies

Get our weekly technology intelligence — free

Receive an infographic that lets you judge at a glance whether each field’s analysis report is worth reading.

Subscribe Free — Weekly Tech Intelligence

By subscribing, you’ll receive Troy-Technical’s weekly technology intelligence newsletter.