Samsung Electro-Mechanics and Qualcomm Jointly Develop Organic Bridge Technology for 2.1D AI Semiconductor Packaging

September 20, 2026

The Elec South Korea

Overview

Samsung Electro-Mechanics and Qualcomm are collaboratively developing an advanced “organic bridge” technology for 2.1D packaging in AI semiconductors. This innovation utilizes organic materials, akin to PCBs, instead of silicon to interconnect multiple dies within a single package, offering a competitive alternative to Intel’s EMIB. The organic bridge facilitates ultrafine circuitry, significantly boosting I/O density and bandwidth crucial for next-generation AI processing.

In Depth

Key Findings

Samsung Electro-Mechanics and Qualcomm are jointly developing a pioneering “organic bridge” technology for advanced 2.1D packaging of AI semiconductors. This innovative approach replaces traditional silicon interposers with organic materials, similar to those found in printed circuit boards (PCBs), to connect multiple semiconductor dies within a single package. The technology promises a significant boost in I/O (input/output) density and data bandwidth, addressing critical bottlenecks in high-performance AI processing.

Technical and Clinical Details

The organic bridge technology is being developed to overcome the cost and manufacturing complexities associated with silicon-based bridges. By leveraging the flexibility and ease of processing inherent in organic materials, this technology enables the creation of ultra-fine circuitry on an organic layer, facilitating high-density electrical connections between chips. This potentially allows for the fabrication of larger bridges, integrating more dies efficiently and increasing the overall I/O count of the package. Organic materials can also offer advantageous thermal expansion coefficients compared to silicon, which can help in mitigating stress between dissimilar materials. Samsung Electro-Mechanics aims to apply this organic bridge technology to 2.1D packaging, essential for enhancing AI semiconductor performance, thereby contributing to the increased processing power of data centers and edge AI devices. This development positions the organic bridge as a strong alternative to silicon bridges like Intel’s Embedded Multi-die Interconnect Bridge (EMIB), intensifying competition in the advanced packaging sector.

Background and Industry Context

The rapid advancement of AI necessitates semiconductor capabilities that can process immense amounts of data at ever-increasing speeds. Consequently, advanced packaging techniques, such as 2.5D and 3D integration, have become paramount for integrating multiple chips into a single package. Interconnect technologies, particularly for efficiently linking High Bandwidth Memory (HBM) and high-performance computing cores, are crucial determinants of AI semiconductor performance. While silicon interposers have been widely used in conventional 2.5D packaging, they face challenges related to high manufacturing costs and size limitations. Organic bridge technology offers a cost-effective solution to these issues, providing greater design flexibility and manufacturing process adaptability. The collaboration between Samsung Electro-Mechanics and Qualcomm is a strategic move, combining Samsung Electro-Mechanics’ expertise in advanced packaging with Qualcomm’s prowess in AI chip design, to establish a leading position in the next-generation AI semiconductor market.

Future Outlook

The organic bridge technology is poised to significantly enhance AI semiconductor performance and cost-efficiency, accelerating the adoption of AI applications across various sectors including data centers, edge AI, and automotive industries. As this technology matures and is implemented, it will enable the design of more complex and higher-performing AI chips, potentially resolving one of the current major bottlenecks in semiconductor manufacturing. Further optimization of organic material choices and manufacturing processes could lead to even greater performance improvements and cost reductions in the future. If this technology scales to mass production, it is expected to influence the packaging strategies of competitors like Intel and TSMC, thereby fostering broader technological innovation across the industry.

Source: https://www.thelec.net/news/articleView.html?idxno=13907

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