Photonics Weekly Report May 13, 2026

Novel Material Overcomes Low-Energy Optical Modulation Barriers, Enhancing AI Scaling and Optical Networks

NTT, SK Group, and Chunghwa Telecom Invest $500 Million in ‘IOWN AI Fund’ to Address AI Power Consumption Challenges

Data Gravity Analysis: AI Interconnects Shift from Copper to Optical, with NVIDIA Leading with CPO-Equipped Spectrum-X Switches

Broadcom Advances Next-Gen 200 Terabit Switch Tapeout with 1.6T DSP and CPO Technology, Targeting $100 Billion in AI Revenue

NVIDIA CEO Jensen Huang Unveils ‘Copper-and-Optics Roadmap,’ Positioning CPO as Core AI Infrastructure by 2028

Cignal AI Forecasts Coherent Pluggable Optics to Lead Telecom Bandwidth, with 800ZR+ Driving ‘Scale-Across’ AI Data Center Applications

Enablence Technologies Secures $5.3 Million Order for Next-Gen 800G/1.6T Optical Communication Products for North American Hyperscalers

HyperLight Corp. Develops Ultra-Low-Power Thin-Film Lithium Niobate Optical Modulators Operating at 0.5V with Sub-1fJ/bit Energy Consumption