Adhesives & Sealants Weekly Report May 13, 2026

Indium Corporation Unveils AuLTRA® 75 Gold-Based Die-Attach Preforms for 5G, Military, and Aerospace GaN Devices at IMS

Chase Corporation Acquires Sheldahl from Flex, Strengthening High-Reliability Material Portfolio for Aerospace and Medical Applications

AI Theme Propels Nikkei 225, Driving Significant Gains for Advanced Packaging Material Companies like Resonac and Mitsui Kinzoku

ECTC 2026: Intel Foundry and Amkor Announce Advanced Packaging Technologies for AI/HPC and U.S. Manufacturing Capacity Expansion

pH- and Cellulase-Triggered Bio-Based Adhesive Facilitates Pharmaceutical Blister Pack Recycling

DELO Unveils DELO PHOTOBOND LA, a Light-Activatable Adhesive for High-Volume LiDAR Production

DiversiTech Acquires Polymer Adhesives, Accelerating Expansion in HVAC-Focused Specialty Adhesives and Sealants Market

German President Visits INM to Witness ‘Living Materials’ and Recyclable Wood Using Bacteria-Derived Bio-Based Adhesives