Key Findings
ERS electronic has introduced an automated panel-level packaging (PLP) system designed for 310×310mm substrates. The system consolidates three thermally critical process steps—temporary carrier bonding, debonding, and detaping—into a single automated platform. The first unit has already been delivered to a leading semiconductor manufacturer for integration into its production line.
Technical Details
The system operates at a throughput of 13 panels per hour. By integrating three traditionally separate processes into one platform, the machine allows panels to move between internal process modules rather than between separate machines. This architecture eliminates the need for inter-tool transfers, which typically introduce handling steps, transit time, and the risk of substrate damage without requiring changes to the existing fab layout.
Background and Context
The system was developed and manufactured at ERS’s Advanced Packaging facility in Barbing, Germany. The development leverages 55 years of thermal management expertise and over 30 years of machine-building capability, supplemented by the 2024 integration of a semiconductor specialist equipment engineering team. ERS is an early adopter of this technology, having shipped its first commercial panel-level tool to Fraunhofer IZM in Berlin in 2018.
Significance and Outlook
The 310×310mm panel format is gaining industry traction due to its ability to significantly improve substrate area utilization compared to 300mm circular wafers. According to Yole Group, the panel-level packaging segment is projected to grow at a compound annual growth rate (CAGR) of over 40% over the next five years. As dual-carrier bonding and debonding workflows become increasingly critical for 3D IC, HBM, and 2.5D IC packaging, this integrated platform aims to improve process consistency, yield, and throughput for manufacturers.
Source: https://www.semiconductor-digest.com/ers-introduces-automated-310mm-panel-level-packaging-system/
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