Lam Research Drives AI Performance with Advanced Packaging, Tackling Bottlenecks and Boosting Power Efficiency through Chiplets and Panel-Based Manufacturing

July 12, 2026

Lam Research USA

Overview

Lam Research highlights advanced packaging as the critical innovation frontier for AI, addressing the limitations of traditional semiconductor scaling. By enabling chiplets to function as a single system, this approach significantly reduces bottlenecks, increases memory bandwidth, and improves power efficiency, leading to substantial AI performance gains. The industry is transitioning from wafer-based to larger panel-based packaging to support more complex AI architectures, with Lam Research’s Salzburg Panel Center of Excellence spearheading large-scale manufacturing.

In Depth

Key Findings

Lam Research is introducing advanced packaging technologies as the new frontier for semiconductor scaling, crucial for meeting the explosive demand from artificial intelligence (AI). The company emphasizes that chiplet technology and the transition to panel-based packaging are key enablers for dramatically boosting AI performance.

Technical Details

According to Audrey Charles, Lam Research’s Senior Vice President of Corporate Strategy and Advanced Packaging, AI growth is outpacing traditional semiconductor process scaling, making advanced packaging indispensable for bridging this gap. Chiplet technology involves integrating multiple independent dies (chiplets) within a single package, allowing them to function as a unified system. This approach significantly reduces data transmission bottlenecks, dramatically increases memory bandwidth through integration with High-Bandwidth Memory (HBM), and improves overall power efficiency. These characteristics directly address the immense data processing power and low power consumption required by AI workloads.

Furthermore, the industry is shifting from conventional wafer-based packaging to larger panel-based packaging formats to enhance manufacturing efficiency and reduce costs. To support this transformation, Lam Research has established its Salzburg Panel Center of Excellence, building large-scale advanced packaging manufacturing capabilities at the panel level. Panel-based processes enable the simultaneous processing of a much greater number of chips, offering potential cost reductions compared to wafer-based methods, especially in fan-out packaging.

Background & Context

The semiconductor industry is encountering the physical limits of Moore’s Law, where scaling transistor density alone is insufficient to meet the performance demands of AI applications. Consequently, advanced packaging, which improves inter-chip connectivity, memory bandwidth, and power delivery, has emerged as a primary means to achieve next-generation performance gains. AI processors, in particular, necessitate the efficient and high-density integration of GPUs and HBM, driving the need for sophisticated packaging technologies.

Strategic Significance & Outlook

Lam Research views panel-based packaging technology as a foundational element for future growth in the AI and high-performance computing (HPC) markets. The company’s technologies are expected to provide the scalability and efficiency required for increasingly complex AI architectures, accelerating innovation across the semiconductor industry. This strategic shift will likely impact a broad supply chain, including materials suppliers and equipment manufacturers, creating new business opportunities and reshaping the competitive landscape.

Source: https://newsroom.lamresearch.com/advanced-packaging-for-ai-semiconductor-scaling

Get our weekly technology intelligence — free

Receive an infographic that lets you judge at a glance whether each field’s analysis report is worth reading.

Subscribe Free — Weekly Tech Intelligence

By subscribing, you’ll receive Troy-Technical’s weekly technology intelligence newsletter.