Key Findings
Amkor Technology is set to deliver a keynote presentation at the SEMI Advanced Packaging Summit 2026 on July 15, where Shinji Baba, the company’s Senior Vice President, will discuss “Advanced Power Module Packaging Technologies.” This presentation will offer Amkor’s insights into the cutting-edge trends, associated electrical and thermal challenges, and innovative interconnect and cooling architectures essential for power device and power module packaging in the era of AI and High-Performance Computing (HPC). This information is crucial for enhancing the reliability and efficiency of semiconductors in high-power applications such as data centers and electric vehicles.
Technical/Clinical Details
The rapid evolution of AI and HPC applications demands unprecedented power density and thermal management capabilities from semiconductor devices. Traditional packaging technologies are increasingly struggling to meet these demands. Shinji Baba’s presentation is expected to delve into specific technical details, including:
- Advanced Interconnection Technologies: New bonding techniques and leadframe designs to handle high current densities while minimizing parasitic resistance and inductance.
- Efficient Cooling Architectures: Sophisticated thermal interface materials (TIMs), heatsink designs, and liquid cooling technologies to effectively dissipate the substantial heat generated by devices.
- Advances in Material Science: Selection and optimization of encapsulants, substrate materials, and adhesives to maintain stable performance under high-temperature conditions.
- Integrated Packaging Solutions: Approaches to consolidate multiple functional blocks into a single package, enabling system miniaturization and performance enhancement.
Background & Context
The SEMI Advanced Packaging Summit 2026, themed “Packaging the Future of AI – From Silicon to Photons,” is a premier event addressing the evolution of packaging technologies in the AI era and their broad impact on the semiconductor industry. AI semiconductors generate significant heat due to their intense computational demands, necessitating high-performance thermal dissipation solutions for stable operation. Leading OSAT (Outsourced Semiconductor Assembly and Test) providers like Amkor Technology play a central role in developing advanced packaging technologies to address these challenges. Amkor’s technology roadmap serves as a vital indicator of the industry’s overall direction.
Strategic Significance & Outlook
Amkor Technology’s presentation will clearly outline the future direction of next-generation power module packaging for AI and HPC applications, providing invaluable insights for semiconductor designers, engineers, and investors to understand upcoming technological trends. The company’s advanced approaches are expected to contribute to the realization of more power-efficient and reliable AI systems and electric vehicles, thereby accelerating technological innovation across related industries. This summit presentation marks a significant step towards overcoming industry challenges and driving sustainable technological advancement.
Source: https://amkor.com/events/advanced-packaging-summit-2026/
Get our weekly technology intelligence — free
Receive an infographic that lets you judge at a glance whether each field’s analysis report is worth reading.
Subscribe Free — Weekly Tech Intelligence
By subscribing, you’ll receive Troy-Technical’s weekly technology intelligence newsletter.
- Your email and selected fields are used only to deliver the newsletter.
- We never share your information with third parties.
- You can unsubscribe anytime via the link in each email.
See our Privacy Policy for details.
Takes about a minute · Unsubscribe anytime
Comments