Key Findings
Amkor Technology participated in ECTC 2026 (Electronic Components and Technology Conference), a prestigious forum in the electronic packaging industry, held from May 26-29, 2026. During the event, JongMin Park presented a significant technical poster titled “Large Package Performance Evaluation of Glass Core Substrates for AI and HPC Applications.” This presentation clearly demonstrates Amkor’s active contribution to the research and development of advanced packaging technologies, particularly new substrate materials crucial for supporting next-generation high-performance computing and artificial intelligence applications.
Technical/Clinical Details
The poster presentation highlighted specific achievements in evaluating glass core substrates as a promising alternative to conventional organic substrates, especially as AI and HPC devices demand higher power delivery, lower signal loss, and superior thermal management. Glass core substrates are highly suitable for fine-pitch wiring and high-density integration due to their exceptionally smooth surfaces, excellent dimensional stability, and low coefficient of thermal expansion (CTE). The presentation provided detailed simulation and experimental data concerning the warpage and stress distribution of glass core substrates in large-scale packaging, as well as their electrical performance and thermal conduction properties. This evidence demonstrated that glass core substrates are a key material for maximizing the performance of AI chips and HPC processors.
Background & Context
In the semiconductor industry, as Moore’s Law approaches its limits, packaging technology has emerged as a new frontier for performance enhancement. AI and HPC workloads depend heavily not only on chip design but also on advanced packaging materials and structures that enable high-density integration of multiple chips, efficient data transfer, and effective heat dissipation. Glass core substrates have garnered significant attention in high-density, high-speed heterogeneous integration packaging due to their advantages over organic substrates, including lower signal transmission loss and a CTE closer to that of silicon. Amkor’s research directly addresses these industry trends.
Strategic Significance & Outlook
Amkor Technology’s research on the large package performance evaluation of glass core substrates provides a vital technological foundation for the future development of AI and HPC applications. As this technology matures and moves into mass production, it will enable the realization of more powerful and energy-efficient AI accelerators and HPC systems, thereby accelerating performance improvements in data centers and fostering the creation of new AI services. Amkor’s ongoing R&D is expected to reinforce its leadership in advanced packaging and contribute to the overall innovation within the semiconductor ecosystem.
Source: https://amkor.com/events/events-ectc-2026/
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