Troy– Author –
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AI X-Ray Imaging: NASA’s spacecraft heat shield meltdown dynamics
NASA / Lawrence Berkeley National Laboratory / University of Illinois Urbana-Champaign USA Overview Scientists have developed a novel method combining advanced X-ray imaging with artificial intelligence to observe the real-time internal ... -
Project Suncatcher: Google’s orbital computing roadmap to 2027
shattered.io USA Overview Google identifies inter-satellite data communication, not the chips themselves, as the biggest challenge for orbital computing and is advancing optical communication as the solution. Its 'Project Suncatcher' uti... -
Nuri Rocket: LG’s 5 commercial components and cost reduction plan
Pulse by Maeil Business News Korea South Korea Overview LG Sciencepark announced that five components from LG Electronics, LG Innotek, and LG Energy Solution will undergo space demonstration aboard a CubeSat during the fifth launch of So... -
Space Reactor-1 Freedom: NASA’s 2028 Mars fission mission timeline
NASA USA Overview NASA is prioritizing nuclear power sources for sustained lunar presence, crewed Mars missions, and outer solar system exploration, independent of solar dependency. In 2028, the first fission interplanetary spacecraft, '... -
Optical Inter-Satellite Links: Orbital data center hardware specs
Mobility Engineering Technology USA Overview The vision of low-Earth orbit (LEO) data centers, offering solar-powered computing without terrestrial land footprint, necessitates the development of terabit-per-second optical inter-satellit... -
Elephantech: Toyosu Packaging Center 2027 launch and specs
Evertiq Japan Overview Japanese PCB and substrate technology developer Elephantech announced it will open its new Toyosu Advanced Packaging Center in Tokyo by March 2027. This center aims to significantly scale up manufacturing and R&... -
Ibiden: 2027 server CPU substrate area and growth projections
FUNDA | Substack USA Overview Ibiden is leveraging its market position due to a severe shortage of qualified high-end ABF substrates, which cannot keep pace with the increasing area and layer counts of AI silicon. Server CPU shipments fr... -
Towa: $31.6M AI chip packaging factory and 2029 supply specs
Globtechwire Japan Overview Japanese semiconductor equipment manufacturer Towa announced plans to invest approximately ¥5 billion ($31.6 million) in a new factory in Kyoto Prefecture to meet increasing demand for advanced semiconductor p... -
Glass Substrates: Intel Clearwater Forest 2026 roadmap
vertexaisearch.cloud.google.com USA Overview In 2026, facing the physical limits of organic substrates, the semiconductor industry is widely adopting glass substrates for advanced packaging. Intel plans to ship its "Clearwater Forest" pr... -
ABF Substrates: 2026 production timeline and layer bottlenecks
TechSoda USA Overview As AI accelerators grow in size, ABF (Ajinomoto Build-up Film) substrates are emerging as a critical supply bottleneck in semiconductor back-end processing. Next-generation AI chips are expected to utilize ABF subst...
