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ECOticias.com (Nature) Spain Overview Scientists have successfully constructed the world's first all-optical photonic time crystal by cyclically modulating a material's optical properties every trillionth of a second. This groundbreaking...

The Herald Business South Korea Overview Korean researchers have developed a next-generation polymer material capable of withstanding temperatures up to 300°C while also being reshaped multiple times after initial hardening. Led by Profe...

360 Mozambique Germany Overview A collaborative team from Karlsruhe Institute of Technology (Germany) and University of Tsukuba (Japan) has developed an innovative cooling system that operates solely on heat energy, rather than electrici...

ScienceDaily (Caltech) USA Overview Researchers at Caltech have developed a novel miniature chip capable of redirecting a light beam in an astonishing 74 femtoseconds (74 quadrillionths of a second). This breakthrough utilizes a nanoscal...

The Debrief News Japan Overview Researchers at Osaka University have made a breakthrough in self-healing materials, identifying a specific metal alloy capable of spontaneously repairing micro-cracks. This innovation extends the concept o...

Technology Innovation Institute (TII) UAE Overview The Technology Innovation Institute's Advanced Materials Research Center (AMRC) has developed an innovative phase change material (PCM) based thermal energy storage solution, offering a ...

3D InCites USA Overview Indium Corporation experts will present advanced materials solutions for advanced packaging, AI, and high-performance computing (HPC) at the IMAPS Symposium. Solutions include ultra-low residue flux for micro-bump...

SEMI USA Overview Four finalists from SEMI Startups for Sustainable Semiconductors presented groundbreaking innovations at SEMICON West 2026. HEXAspec Inc. achieved a 10x improvement in thermal conductivity with hBN nanosheet-polymer enc...

Brewer Science USA Overview Brewer Science will present new data at IMAPS 2026 on a high-temperature-stable laser release material, designed for advanced packaging processes from 250°C to 350°C. This material supports demanding processes...

YINCAE (via Electronics Media) USA Overview YINCAE unveiled its UV-curable underfill technologies, UF 66UV and UF 88UV, at IMAPS 2026. UF 66UV offers high-speed processing and robust reliability for advanced electronic packaging. Notably...