Market Trends– category –
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Japan’s Interstellar Technologies Unveils Progress on Hokkaido Spaceport’s Launch Complex 1
Interstellar Technologies Inc. Japan Overview Japanese private space transport company Interstellar Technologies (IST) has released a video update on the construction of 'Launch Complex 1' at Hokkaido Spaceport. This facility is crucial ... -
Amazon Leo Announces 100 Gbps Optical Intersatellite Links to Build High-Speed, Low-Latency Mesh Network Challenging Starlink
Orbital Radar USA Overview Amazon's 'Amazon Leo' (formerly Project Kuiper) low Earth orbit satellite constellation will incorporate 100 Gbps optical intersatellite links (OISL) on each satellite. This will create a space-based mesh netwo... -
ASMPT’s Advanced Packaging Business Achieves Record Sales in H1 2026, Driven by Surging AI Demand
ASMPT Singapore Overview ASMPT reported robust financial results for the first half of 2026, with its Advanced Packaging (AP) business achieving record sales, significantly propelled by escalating AI demand. Key contributors included The... -
ASE Technology Bets Big on AI: $10.5 Billion Record Capex to Double Advanced Packaging by 2027
TrendForce Taiwan Overview ASE Technology Holding is significantly increasing its 2026 capital expenditure to a record $10.5 billion, aiming to double the revenue of its leading-edge advanced packaging (LEAP) business by 2027. This ambit... -
SEMICON West Relocates to Phoenix, Arizona, Bolstering U.S. Semiconductor Hub with TSMC’s $100 Billion Advanced Fab Plans
Arizona Commerce Authority USA Overview SEMI announced the permanent relocation of SEMICON West to Phoenix, Arizona, adopting an annual spring schedule from March 30 – April 1, 2027. This move reflects Arizona's rapid expansion as a semi... -
AI Chip HBM Integration to Drive 29% ABF Substrate Shortage by 2028; $19.1B Expansion Unlikely to Offer Short-Term Relief
Unknown Taiwan Overview The rapid integration of High Bandwidth Memory (HBM) into AI chips is set to drive a 39% Compound Annual Growth Rate (CAGR) in ABF substrate demand between 2025 and 2028. This surge is projected to create a supply... -
ASE Technology Ups 2026 Capex to Record $10.5 Billion, a 23.5% Increase, Driven by Surging AI Packaging Demand
Digitimes Taiwan Overview ASE Technology Holding, the world's largest semiconductor packaging and test provider, increased its 2026 capital expenditure plan by 23.5% to a record $10.5 billion from an initial $8.5 billion, responding to s... -
Malaysia Invests US$45 Million to Propel Advanced Chip Packaging, Targeting HBM4 Domestic Proof-of-Concept
Asia News Network Malaysia Overview Malaysia announced a 185 million ringgit (approx. US$45 million) investment into semiconductor projects to boost its advanced chip packaging capabilities for AI, data centers, and high-performance comp... -
Besi Achieves Record €292.9M Orders in Q2 2026, Driven by AI Demand and 128.8% Growth in Hybrid Bonding Technology
ET Electronics News Netherlands Overview BE Semiconductor Industries (Besi) reported record Q2 2026 orders of €292.9 million, a 128.8% increase year-over-year, primarily fueled by robust AI-related demand and the surging adoption of its ... -
GLP-1 Review Finds Strongest Signals for GI Adverse Events, Hints at Reduced Infection/Respiratory Risk
GI and Hepatology News USA Overview A systematic review and meta-analysis published in JAMA Network Open found that GLP-1 receptor agonists (GLP-1 RAs) consistently increase gastrointestinal side effects like nausea, vomiting, and diarrh...
