New Technology– category –
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India’s Izmo Microsystems Successfully Manufactures Quantum Modules and Thin-Film Lithium Niobate Modulators, Targets 2027 Commercial Release of AI/Cloud Optical Transceivers
Izmo Microsystems India Overview India's Izmo Microsystems has successfully manufactured quantum modules and thin-film lithium niobate (TFLN) modulators, demonstrating advanced packaging techniques for photonic integrated circuits. The c... -
NLM Photonics and LIGENTEC Unveil First Visible-Band Quantum Organic Hybrid Modulators on Commercial SiN Platform
NLM Photonics USA Overview NLM Photonics and LIGENTEC have jointly produced the first silicon nitride organic hybrid (NOH) modulators operating in the visible spectrum on a commercial silicon nitride (SiN) photonics platform. This achiev... -
IP Infusion Highlights 800ZR Pluggable Optics for 2026, Driving Major Network Efficiency Gains through IP-Optical Convergence
IP Infusion USA Overview IP Infusion is championing the convergence of IP and optical networks via technologies like IPoDWDM and Open ZR/ZR+, with 800ZR pluggable optical modules anticipated for commercial deployment in 2026. This integr... -
Intel and Ayar Labs Propel 224Gbps+ Scale-Up with Co-Packaged Optics, Extending NVIDIA NVLink
Silicon Co-Design USA Overview Co-Packaged Optics (CPO) technology is enabling 224Gbps+ scale-up interconnects, with Intel pursuing a truly integrated approach via its Optical Compute Interconnect (OCI) that heterogeneously integrates In... -
NTT West Expands “All-Photonics Connect powered by IOWN” Service Across Western Japan to Bolster AIOWN Infrastructure
ASCII Japan Overview NTT West is set to expand its "All-Photonics Connect powered by IOWN" Type 3 and Type 4 services across the entire western Japan region, beginning with Hokuriku in September 2027 and Shikoku in January 2028. This exp... -
EV Group Solves Co-packaged Optics Manufacturing Challenges with Wafer Bonding and Nanoimprint for High-Density Integration
Quality Digest USA Overview EV Group (EVG) is addressing critical manufacturing challenges for Co-packaged Optics (CPO), which integrates Photonic Integrated Circuits (PICs), lasers, and optical structures within a single package. EVG's ... -
FS Unveils 1.6T Scale-Out Optics with 500 km Coherent Modules for AI Fabrics, Validated on NVIDIA Quantum-X800
StorageReview.com USA Overview FS has introduced a new AI optics portfolio featuring 1.6T scale-out transceivers for GPU cluster links and 500 km coherent modules for inter-site connections. The 1.6T OSFP-DR8-1.6T and OSFP-2FR4-1.6T modu... -
Tower Semiconductor and NewPhotonics Initiate High-Volume Shipments of Laser-Integrated PICs for 800G/1.6T AI Interconnect
Unite.AI USA Overview Tower Semiconductor and NewPhotonics have commenced high-volume shipments of laser-integrated optical engine Photonic Integrated Circuits (PICs) for AI interconnect applications, supporting 800G to 1.6T data rates. ... -
GIGALIGHT Unveils 18W Ultra-Low Power 1.6T AI Interconnect at ECOC 2026, Signaling Independence from Liquid Cooling
GIGALIGHT Press Releases China Overview GIGALIGHT showcased a hybrid technology at ECOC 2026 for 1.6T AI interconnects, achieving a significantly reduced power consumption of 18W compared to mainstream 3nm full-DSP solutions. This innova... -
AI Infrastructure Startups Drive Optical Interconnect Breakthroughs Beyond Copper Limits: Ayar Labs, Lightmatter, and HyperLight Lead Innovation
New Market Pitch USA Overview Leading AI infrastructure startups, including Ayar Labs, Lightmatter, and HyperLight, are advancing optical interconnect technologies to overcome the limitations of copper cabling. Ayar Labs is expanding pro...
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