Photonics– category –
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TIER IV and Renesas Partner to Develop AI-Native Software-Defined Vehicle Platform, Integrating Advanced Sensing and Photonic Computing
Design And Reuse Japan Overview Japanese autonomous driving firm TIER IV and semiconductor giant Renesas Electronics have announced a partnership to co-develop an AI-native Software-Defined Vehicle (SDV) platform. This collaboration aims... -
Arteris Reports High Premium for AI Chip IP, Reflecting Soaring Demand for Specialized Silicon
Design And Reuse USA Overview Arteris has observed a significant premium for AI chip intellectual property (IP) in the market, underscoring the escalating value of specialized IP in AI hardware development. Semiconductor manufacturers ar... -
Alibaba Develops RISC-V Chip Capable of Running 27 Billion Parameter AI Model Without GPU
Design And Reuse China Overview Alibaba has developed a RISC-V-based chip that can execute a 27 billion parameter AI model without relying on a GPU. This achievement signals significant progress in specialized alternative chip architectu... -
Rapidus Targets 8-Reticle Interposers on 600mm Advanced Packaging Panels by 2030, Accelerating Heterogeneous Integration for AI/HPC
Design And Reuse Japan Overview Japanese foundry Rapidus has unveiled an ambitious roadmap to achieve 8-reticle interposers on 600mm advanced packaging panels by 2030. This development is crucial for integrating complex chiplets, includi... -
TSMC Completes 1.6nm A16 Process Development, Targets Q4 Mass Production for Next-Gen AI/HPC Chips
Design And Reuse Taiwan Overview TSMC has successfully completed development of its 1.6nm A16 process technology, with mass production scheduled for Q4. This cutting-edge process is foundational for next-generation high-performance compu... -
Shanghai Jiao Tong University Develops FOWLP for Seamless Opto-Electronic Integration, Halving Signal Loss in Data Centers
IMAPS 3D InCites Content Platform China Overview Researchers at Shanghai Jiao Tong University have pioneered a fan-out wafer-level packaging (FOWLP) technique to integrate electronic and photonic components, significantly reducing signal... -
Ciena Gains Focus with e& UAE Network Deal, Deploying WaveLogic Coherent Optical Technology for High-Capacity Regional Networks
Kalkine Media USA Overview Ciena is drawing significant attention with its e& UAE (formerly Etisalat UAE) network deployment, providing integrated solutions including advanced optical hardware, coherent technology, and network contro... -
High-Frequency MLCC Evolution Critical for 800G/1.6T Optical Modules: Enabling AI-Era High-Capacity Communications
Barron (Barron MLCC) International Overview The evolution of high-frequency multilayer ceramic capacitors (MLCCs) is proving critical for enabling next-generation 800G and 1.6T optical modules. These ultra-high-speed modules require ultr... -
Ciena Awaits Q3 2026 Earnings, Market Focus on Coherent Optical Solutions and Network Automation Trajectory
MarketBeat USA Overview Ciena is set to announce its Q3 FY226 earnings, drawing market attention to its performance and strategic direction. Its product portfolio, tailored for carriers, cloud providers, and large enterprises, encompasse... -
Coherent Accelerates AI Optical Interconnect Growth with NVIDIA Partnership and $2 Billion US Investment Plan, Meeting 800G/1.6T Demand
Andy Lin's Long-term Stock Investment Blog USA Overview Coherent is addressing increasing demand for advanced 800G/1.6T optical transceivers and photonic components driven by expanding AI data center infrastructure and high-performance c...
