Photonics– category –
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EV Group Solves Co-packaged Optics Manufacturing Challenges with Wafer Bonding and Nanoimprint for High-Density Integration
Quality Digest USA Overview EV Group (EVG) is addressing critical manufacturing challenges for Co-packaged Optics (CPO), which integrates Photonic Integrated Circuits (PICs), lasers, and optical structures within a single package. EVG's ... -
Huawei Unveils 7.2Tbps Near-Packaged Optics Module and Establishes China’s First NPO MSA, Challenging NVIDIA and Broadcom’s CPO Push
TrendForce China Overview Huawei has unveiled a 7.2Tbps Near-Packaged Optics (NPO) module and launched the "OPEN NPO" initiative, establishing China's first NPO optical interconnect Multi-Source Agreement (MSA), directly challenging the ... -
CIOE 2026: 1.6T Optical Transceiver Orders Extend into 2027, Supply Capacity Dictates Market Leadership
Optics (FundaAI) USA Overview At CIOE 2026, it was revealed that 1.6T optical transceiver orders and production schedules are extending into 2027 due to rapidly increasing demand. Leading suppliers like InnoLight, Eoptolink, Coherent, an... -
FS Unveils 1.6T Scale-Out Optics with 500 km Coherent Modules for AI Fabrics, Validated on NVIDIA Quantum-X800
StorageReview.com USA Overview FS has introduced a new AI optics portfolio featuring 1.6T scale-out transceivers for GPU cluster links and 500 km coherent modules for inter-site connections. The 1.6T OSFP-DR8-1.6T and OSFP-2FR4-1.6T modu... -
NTT’s IOWN AI Fund Makes Inaugural Investment in iPronics for AI Data Center Programmable Optical Networking
The Fast Mode Japan Overview NTT's IOWN AI Fund has made its first investment in iPronics, a developer of programmable optical networking technology for AI data centers. iPronics' silicon photonics-based platform dynamically reconfigures... -
Tower Semiconductor and NewPhotonics Initiate High-Volume Shipments of Laser-Integrated PICs for 800G/1.6T AI Interconnect
Unite.AI USA Overview Tower Semiconductor and NewPhotonics have commenced high-volume shipments of laser-integrated optical engine Photonic Integrated Circuits (PICs) for AI interconnect applications, supporting 800G to 1.6T data rates. ... -
GIGALIGHT Unveils 18W Ultra-Low Power 1.6T AI Interconnect at ECOC 2026, Signaling Independence from Liquid Cooling
GIGALIGHT Press Releases China Overview GIGALIGHT showcased a hybrid technology at ECOC 2026 for 1.6T AI interconnects, achieving a significantly reduced power consumption of 18W compared to mainstream 3nm full-DSP solutions. This innova... -
Co-Packaged Optics (CPO) Nears Mass Production: Interfaces, Yield, and Maintainability Emerge as Next Key Challenges
DIGITIMES Taiwan Overview As AI computing bandwidth demands escalate, optical interconnect architectures are shifting from pluggable optical modules to near-packaged optics (NPO) and co-packaged optics (CPO), moving closer to mass produc... -
AI Infrastructure Startups Drive Optical Interconnect Breakthroughs Beyond Copper Limits: Ayar Labs, Lightmatter, and HyperLight Lead Innovation
New Market Pitch USA Overview Leading AI infrastructure startups, including Ayar Labs, Lightmatter, and HyperLight, are advancing optical interconnect technologies to overcome the limitations of copper cabling. Ayar Labs is expanding pro... -
Ayar Labs Secures Additional $150M, Totaling $650M for 2026, to Scale Co-Packaged Optics (CPO) for AI Infrastructure
Converge Digest USA Overview Ayar Labs has raised an additional $150 million, bringing its total 2026 funding to $650 million, to expand manufacturing capacity for co-packaged optics (CPO) targeting AI scale-up infrastructure. The compan...
