Polymers & Resins– category –
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JLC3DP Clarifies PLA’s Practical Heat Resistance Limit for 3D Printing at Below 50-60°C, Recommends High-Performance Materials for Elevated Temperatures
JLC3DP China Overview JLC3DP has released guidelines on the heat resistance of PLA, a common 3D printing material. While PLA softens around 55-65°C and melts at 150-180°C, sustained high-load applications should avoid temperatures exceed... -
ACS Review Highlights ‘Functionalization Paradox’ in Sustainable AM, Cautioning Against Increased Carbon Footprint from Bio-Derived Materials’ Chemical Modification
ACS Publications USA Overview A new review evaluates the transition to sustainable 3D printing, specifically in vat photopolymerization, which heavily relies on petroleum-derived and non-recyclable thermosets. It identifies a 'functional... -
Comprehensive Review on Sustainable Polymer Additive Manufacturing Published by MDPI, Advocating Multi-Faceted Evaluation of Performance, Processing Burden, and Recyclability
MDPI Switzerland Overview A comprehensive review on the feasibility of sustainable polymer additive manufacturing (AM) has been published by MDPI. The review compares three primary AM pathways—SLA, DLP, and FDM—highlighting challenges in... -
Novel Hyperbranched Polyphenylsiloxane-Modified Epoxy Resin Achieves Dielectric Constant of 2.82 and Dissipation Factor of 0.02050 at 100 MHz for Electronic Packaging
ACS Publications USA Overview A new facile method has been reported for constructing hyperbranched polyphenylsiloxane (HBPSi)-modified epoxy resins with excellent low dielectric properties for electronic packaging. The developed DGEBA/HB... -
Sumitomo Chemical and Gutenberg Co-Develop Liquid Crystal Polymer Filament for 3D Printing in Semiconductor and AI Applications
Plastics Today Japan Overview Sumitomo Chemical and Gutenberg Co. in Tokyo have successfully co-developed a liquid crystal polymer (LCP) filament specifically for 3D printing applications in semiconductors, AI, and next-generation mobili... -
INTAMSYS and JLC3DP Launch Scalable PEEK and PEKK 3D Printing Services for Aerospace and Semiconductor Applications
INTAMSYS / JLC3DP China Overview INTAMSYS and JLC3DP have introduced scalable 3D printing services for PEEK and PEKK, targeting high-demand engineering sectors such as aerospace, semiconductors, energy, automotive, and robotics. Supporte... -
Bilby3D Unveils High-Temperature 3D Printing Filaments, Including ThermaX PEEK/TPI, for Aerospace and Automotive Sector Operating Above 120°C
Bilby3D Australia Overview Bilby3D has introduced a new line of high-temperature 3D printing filaments, featuring advanced polymers like ThermaX TPI (Thermoplastic Polyimide) and ThermaX PEEK. These materials are engineered to withstand ... -
Polymers & Resins Weekly Report September 6, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report September 06, 2026 (PDF) — Download Weekly Report September 06, 2026 (PDF) — DownloadDownload 🎙 Podcast Septe... -
Veloxis Pharmaceuticals Initiates First Patient Dosing in Phase 2 RENGEVITY-201 Trial for Pegrizeprument to Prevent Organ Rejection in Kidney Transplant Recipients
Asahi Kasei Corporation USA Overview Veloxis Pharmaceuticals, an Asahi Kasei Group company, has commenced dosing the first patient in its Phase 2 clinical trial, "RENGEVITY-201," for Pegrizeprument, an investigational drug aimed at preve... -
UK’s International Composites Summit 2026 to Gather Over 250 Industry Leaders in London for Collaboration and Innovation
International Composites Summit UK Overview The International Composites Summit (ICS) 2026, a leading event for the UK's composites industry, is slated for December 1-2, 2026, at The Drum in London. This summit will unite over 250 indust...
