3D Printing– tag –
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New Technology
SUNLU and Inslogic Jointly Unveil ‘i10’ Filament Dehumidifying Cabinet, Utilizing Molecular Sieve Technology for Highly Hygroscopic Filaments like Nylon, PVA, and TPU
SUNLU China Overview SUNLU, in collaboration with Inslogic, launched the 'i10 Filament Dehumidifying Cabinet,' an essential tool for maintaining 3D printing filament quality. This product incorporates advanced molecular sieve dehumidific... -
New Technology
Dental 3D Printers Recommended for Rapid In-Office Production of Guides, Models, and Temporaries Using Photoresist Resins, According to GlobalDentex Checklist
GlobalDentex USA Overview GlobalDentex's new checklist for chairside dental equipment highlights dental 3D printers using photoresist resins as highly effective tools for rapid in-office fabrication of surgical guides, diagnostic models,... -
New Technology
Apple Introduces Groundbreaking Multi-Layer Custom Photoresist 3D Printing to Eliminate Undulations in Foldable iPhone ‘Duo’
BigGo Finance USA Overview Apple has integrated an innovative manufacturing technique for its upcoming foldable iPhone 'Duo,' employing 3D printing of up to 25 layers of custom photoresist to eliminate surface undulations. This process i... -
New Technology
Sumitomo Chemical and Gutenberg Co-develop High Thermal Conductivity, Aluminum-Strength LCP Filament for FFF 3D Printers; Sample Provision Expected in 2026
Sumitomo Chemical Japan Overview Sumitomo Chemical and Gutenberg have jointly developed an innovative Liquid Crystal Polymer (LCP) filament and molding technology for Fused Filament Fabrication (FFF) 3D printers, achieving high thermal c... -
Polymers & Resins
NIST Commercializes New 3D-Printing Reference Material RM 8047 to Standardize Photopolymer Manufacturing, Enhancing Quality Control and Reproducibility
WhatTheyThink USA Overview The U.S. National Institute of Standards and Technology (NIST) has announced the commercial availability of Reference Material (RM) 8047, designed to significantly improve quality control, accuracy, and reprodu... -
Polymers & Resins
Researchers Develop Multi-Layer Metal and Ceramic Coatings for 3D-Printed Polymer Parts, Significantly Enhancing Wear Resistance and Adhesion
AZoM UK Overview Researchers have demonstrated a multi-layer coating technology designed to overcome the surface quality and durability limitations of 3D-printed polymer parts. By applying metal and ceramic multi-layer coatings to materi... -
Polymers & Resins
JLC3DP Clarifies PLA’s Practical Heat Resistance Limit for 3D Printing at Below 50-60°C, Recommends High-Performance Materials for Elevated Temperatures
JLC3DP China Overview JLC3DP has released guidelines on the heat resistance of PLA, a common 3D printing material. While PLA softens around 55-65°C and melts at 150-180°C, sustained high-load applications should avoid temperatures exceed... -
Polymers & Resins
ACS Review Highlights ‘Functionalization Paradox’ in Sustainable AM, Cautioning Against Increased Carbon Footprint from Bio-Derived Materials’ Chemical Modification
ACS Publications USA Overview A new review evaluates the transition to sustainable 3D printing, specifically in vat photopolymerization, which heavily relies on petroleum-derived and non-recyclable thermosets. It identifies a 'functional... -
Polymers & Resins
Comprehensive Review on Sustainable Polymer Additive Manufacturing Published by MDPI, Advocating Multi-Faceted Evaluation of Performance, Processing Burden, and Recyclability
MDPI Switzerland Overview A comprehensive review on the feasibility of sustainable polymer additive manufacturing (AM) has been published by MDPI. The review compares three primary AM pathways—SLA, DLP, and FDM—highlighting challenges in... -
Polymers & Resins
Sumitomo Chemical and Gutenberg Co-Develop Liquid Crystal Polymer Filament for 3D Printing in Semiconductor and AI Applications
Plastics Today Japan Overview Sumitomo Chemical and Gutenberg Co. in Tokyo have successfully co-developed a liquid crystal polymer (LCP) filament specifically for 3D printing applications in semiconductors, AI, and next-generation mobili...