ASE Group– tag –
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Yole Group Forecasts Advanced Packaging Market to Double to Over $120 Billion by 2031, Driven by AI and HPC Demand
Yole Group (via advancedpackaging.news) France Overview Yole Group's latest report projects the global advanced packaging market to more than double from $55 billion in 2025 to over $120 billion by 2031, fueled by next-generation AI and ... -
ASE Initiates Largest-Ever Global Expansion to Double CoWoS Capacity to 45,000 Wafers/Month by Late 2027
Industry Blog/Analysis International Overview ASE is undertaking its largest global factory expansion in history, commencing construction of six new packaging and testing plants in 2026. This aggressive ramp aims to increase monthly CoWo... -
Advanced Packaging Becomes the New Bottleneck for AI Chip Production, Driving Global Capex Race and Nvidia’s Supply Diversification Efforts
The Economy International Overview Advanced packaging, not process technology, is now the primary bottleneck in AI chip production, prompting Nvidia to explore diversifying its CoWoS supply, potentially including Intel's EMIB. This shift... -
Morgan Stanley Forecasts 93% Surge in CoWoS Demand by 2027, Anticipates AMD Venice CPU Adoption
Phemex News USA Overview Morgan Stanley projects a staggering 93% surge in global demand for CoWoS (Chip-on-Wafer-on-Substrate) technology by 2027, reaching 2.694 million units. Nvidia is expected to remain the largest consumer, accounti... -
ASE Elevates Advanced Packaging Quotes Over 20% Amid Explosive AI Demand Crunch
SiliconAnalysts Taiwan Overview ASE Technology, the world's largest outsourced semiconductor assembly and test (OSAT) provider, has increased its advanced packaging service prices by over 20%. This hike is a direct response to unpreceden... -
ASE to Commence FOPLP Mass Production by End-2026, Launching 15 Expansion Projects Amid AI Chip Boom
TrendForce Taiwan Overview ASE Technology, the world's largest semiconductor packaging and testing services provider, announced plans to begin mass production of Fan-out Panel-Level Packaging (FOPLP) by the end of 2026. This initiative, ... -
OSAT Vendors Report Strong Q1 2026 Revenue Growth Driven by AI-Related Advanced Packaging Demand: ASE Up 18%, Amkor Up 25%
Counterpoint Research Global Overview The Outsourced Semiconductor Assembly and Test (OSAT) sector recorded robust revenue growth in Q1 2026, fueled by surging AI-driven advanced packaging demand. ASE Technology Holding reported an 18% y... -
ASE Technology Holding Accelerates AI Chip Production with Major Packaging Expansion, Raises 2026 LEAP Revenue Target to Over $3.5 Billion
Crypto Briefing Taiwan Overview ASE Technology Holding is embarking on a significant global expansion, including 15 new facilities, to address the escalating demand for AI chips. This strategic move, leveraging their LEAP platform and VI... -
Morgan Stanley Raises CoWoS Demand Forecast to 2.69 Million Wafers by 2027, Citing CPUs and ASICs as New Drivers
Industry Analysis / Moomoo Unknown Overview Morgan Stanley has significantly raised its demand forecast for TSMC's CoWoS packaging, projecting it to reach 2.69 million wafers annually by 2027. CPUs and ASICs are emerging as new key drive... -
ASE Technology Holding Raises 2026 Capex to $8.5 Billion Driven by Surging AI Advanced Packaging Demand, Launches 15 Expansion Projects in Taiwan & Malaysia
SemiMedia Taiwan Overview ASE Technology Holding, the world's largest OSAT provider, has significantly increased its 2026 capital expenditure plan from $7 billion to $8.5 billion, a 21.4% jump, driven by robust demand from AI servers, HP...
