ASE Group– tag –

Zacks USA Overview ASE Technology Holding expressed strong confidence in its Leading Edge Advanced Packaging (LEAP) business trajectory, raising its 2026 LEAP revenue outlook by 10% to over $3.5 billion. This upward revision explicitly r...

AXTEK Technology Company Limited Taiwan Overview ASE Technology Holding, the world's largest OSAT provider, plans to increase its backend wafer packaging prices by 5-20% in 2026, driven by a surge in AI-powered semiconductor demand. With...

Electronics Engineering Herald - EEHerald USA Overview AMD announced an investment exceeding $10 billion in Taiwan's ecosystem to expand its AI infrastructure and advanced packaging manufacturing capabilities. This significant capital in...

AnySilicon Taiwan Overview Advanced Semiconductor Engineering (ASE) has developed an automated 310mm x 310mm panel-level packaging (PLP) production line, a significant advancement for AI processors and chiplet architectures. This industr...

EE Times Taiwan Overview AMD announced an investment exceeding $10 billion into Taiwan's AI ecosystem, bolstering advanced packaging capabilities and R&D. This initiative specifically targets Elevated Fanout Bridge (EFB) based 2.5D p...

digitimes Taiwan Overview ASE Technology Holding, the world's largest chip packaging and test company, has significantly raised its 2026 capital expenditure to a record $8.5 billion, driven by surging demand for AI chips. The company pro...

ASE Technology Holding Co., Ltd. Taiwan Overview ASE Technology Holding and WUS Printed Circuit have unveiled a strategic collaboration to construct a state-of-the-art manufacturing facility in Kaohsiung, Taiwan, backed by an investment ...

FinancialContent - Stock Market Taiwan Overview TSMC is aggressively expanding its CoWoS and SoIC advanced packaging capacity to address the soaring demand for AI chips, aiming to increase monthly wafer output from approximately 35,000 u...