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ASE Unveils Industry-First Automated 310mm Panel-Level Packaging Line for AI and Chiplet Integration
AnySilicon Taiwan Overview Advanced Semiconductor Engineering (ASE) has developed an automated 310mm x 310mm panel-level packaging (PLP) production line, a significant advancement for AI processors and chiplet architectures. This industr... -
AMD Commits Over $10 Billion to Taiwan’s AI Ecosystem for Advanced Packaging and EFB Technology Expansion
EE Times Taiwan Overview AMD announced an investment exceeding $10 billion into Taiwan's AI ecosystem, bolstering advanced packaging capabilities and R&D. This initiative specifically targets Elevated Fanout Bridge (EFB) based 2.5D p...
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