Co-packaged Optics– tag –
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ASMPT to Showcase Advanced Thermocompression and Hybrid Bonding Innovations for HPC and AI at SEMICON Taiwan 2026
ASMPT SEMI Solutions Taiwan Overview Global technology leader ASMPT announced it will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, supporting HPC, AI accelerators, silicon photonics, and Co-Packaged Optics (CPO) appl... -
GlobalFoundries Elevates Data Center Energy Efficiency with Strategic 48V Power Delivery Approach
GlobalFoundries USA Overview GlobalFoundries has outlined a strategic approach to 48V power delivery in its Insights blog, aiming to enhance energy efficiency in data centers and high-performance computing (HPC). While not directly photo... -
Shanghai Jiao Tong University Develops FOWLP for Seamless Opto-Electronic Integration, Halving Signal Loss in Data Centers
IMAPS 3D InCites Content Platform China Overview Researchers at Shanghai Jiao Tong University have pioneered a fan-out wafer-level packaging (FOWLP) technique to integrate electronic and photonic components, significantly reducing signal... -
Enablence and ShunYun Achieve Volume Production Readiness in Vietnam for 800G/1.6T, CPO/LPO High-Speed PLCs, Bolstering Non-China Supply
Newsfile USA Overview Enablence Technologies and ShunYun Technology have achieved volume production readiness at their new Vietnam facility, set to support the growth of AI data centers. The factory will produce high-speed Planar Lightwa... -
Lumentum Drives 1.6T Optical Module Market with NVIDIA Multi-Billion Deal, Expands Japan Production for AI Data Centers
MarketBeat USA Overview Lumentum is capitalizing on the rapid shift to optical connectivity in AI data centers, achieving market leadership with its 1.6T optical modules. The company commenced shipments in Q4 FY2026 and secured a multi-b... -
SK Hynix Pioneers Optical Interconnects Beyond HBM, Outlines Roadmap for AI Bandwidth Challenges
Adalytica South Korea Overview SK Hynix is charting a course for optical chip connections that extend beyond High Bandwidth Memory (HBM) to address critical bandwidth limitations in large-scale AI systems. A recent Nature Electronics rev... -
LandMark Optoelectronics Reports Significant Profit Surge Driven by Surging Silicon Photonics Demand
digitimes Taiwan Overview LandMark Optoelectronics has reported a significant increase in profits, propelled by surging demand in the silicon photonics market. This performance reflects the strong impact of expanding optical interconnect... -
IMAPS Report Highlights Silicon Photonics, Co-Packaged Optics, and Advanced Packaging as Critical for Breaking AI Data Center Compute Barriers
IMAPS 3D InCites Content Platform USA Overview An IMAPS 3D InCites report emphasizes that optical interconnects are indispensable for addressing the massive demands placed on data centers by the rapid growth of large language models. A k... -
Lightmatter-Led Open Compute Project Launches ‘Open Silicon Photonics for AI Systems’ Initiative with 19 Industry Leaders to Standardize Co-Packaged Optics Infrastructure
Lightmatter® USA Overview Lightmatter has officially launched the 'Open Silicon Photonics for AI Systems' initiative within the Open Compute Project (OCP), uniting 19 industry leaders including Celestica, Dell Technologies, and Qualcomm.... -
NVIDIA’s $2 Billion Investment Validates Coherent’s AI Optics Strategy, Driving Leadership in AI Data Center Transceiver Market
HDIN Research USA Overview Coherent achieved significant revenue growth in FY26, largely driven by the deployment of 800G and 1.6T AI transceivers for hyperscalers. A strategic $2.0 billion equity investment from NVIDIA strongly validate...
