Co-packaged Optics– tag –
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China’s Zhongji Innolight Secures $6.81 Billion in Record Hong Kong IPO Amid Deepening Indium Phosphide Shortage for AI Optics
TrendForce Taiwan Overview Zhongji Innolight, a leading Chinese optical transceiver manufacturer, raised HK$53.41 billion ($6.81 billion) in Hong Kong's largest IPO of 2026, aiming to expand its high-speed optical module business for maj... -
Tokyo Electron: Co-Packaged Optics (CPO) Key to Unlocking AI Data Center Performance, Slashing Power and Bottlenecks; NVIDIA and Broadcom Integrate Technology
Tokyo Electron Japan Overview Tokyo Electron highlights Co-Packaged Optics (CPO) as a pivotal technology for next-generation AI data centers, significantly reducing power consumption and mitigating communication bottlenecks. CPO achieves... -
ASE Technology Bets Big on AI: $10.5 Billion Record Capex to Double Advanced Packaging by 2027
TrendForce Taiwan Overview ASE Technology Holding is significantly increasing its 2026 capital expenditure to a record $10.5 billion, aiming to double the revenue of its leading-edge advanced packaging (LEAP) business by 2027. This ambit... -
Amkor to Invest $7 Billion in Arizona for Advanced AI Chip Packaging, Shifts Korean SiP Production to Vietnam
Seeking Alpha USA Overview Amkor Technology is making a monumental $7 billion investment to construct an advanced packaging and test campus in Arizona, slated for production by early 2028, to address the escalating demand for AI chips. T... -
Besi Achieves Record €292.9M Orders in Q2 2026, Driven by AI Demand and 128.8% Growth in Hybrid Bonding Technology
ET Electronics News Netherlands Overview BE Semiconductor Industries (Besi) reported record Q2 2026 orders of €292.9 million, a 128.8% increase year-over-year, primarily fueled by robust AI-related demand and the surging adoption of its ... -
NVIDIA and Broadcom Commence Mass Production of Co-Packaged Optics (CPO) Switches: Poised to Cut Data Center Power Consumption by Up to 3.5x
Electronics360 USA Overview NVIDIA and Broadcom have initiated mass production of Co-Packaged Optics (CPO) switches, designed to significantly reduce data center power consumption and latency. NVIDIA's Spectrum-X CPO switch, co-developed... -
Lightmatter Joins NVIDIA NVLink Fusion Ecosystem, Accelerates Photonic Interconnect Strategy for AI Data Centers with $850M Funding at $4.4B Valuation
International Banker USA Overview AI hardware and silicon photonics startup Lightmatter has joined NVIDIA's NVLink Fusion ecosystem, accelerating the deployment of high-performance optical interconnects for AI infrastructure. The company... -
Broadcom Initiates Mass Production of 800G CPO Switch ASICs for Next-Gen AI/HPC Data Centers, Slashing Power and Latency
Photonics News Weekly USA Overview Leading semiconductor manufacturer Broadcom has commenced mass production of its 800G Co-Packaged Optics (CPO) switch ASICs, specifically designed for AI and HPC data centers. This innovative ASIC integ... -
BESI Records All-Time High Orders with 128.8% Y-o-Y Growth Driven by AI Packaging and Hybrid Bonding Demand
BE Semiconductor Industries N.V. Netherlands Overview BE Semiconductor Industries (BESI), a Dutch equipment manufacturer, reported a record €292.9 million in orders for Q2 2026, marking a 128.8% year-on-year increase, fueled by strong de... -
Co-Packaged Optics (CPO) Demand Reshapes AI Chip Supply Chains, Shifting Towards Higher Bandwidth and Lower Power Consumption
Astute Group UK Overview The surging demand for Co-Packaged Optics (CPO) is fundamentally reshaping semiconductor manufacturing priorities across advanced packaging and AI processor supply chains. As AI clusters increasingly require high...
