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Powertech and Broadcom Launch $400M Singapore Joint Venture to Expand FOPLP Manufacturing for AI ASICs
Taipei Times Taiwan Overview Powertech Technology has approved a $400 million joint venture with Broadcom in Singapore to establish advanced Panel-Level Packaging (PLP) manufacturing capabilities, focusing on additive fine-line RDL techn... -
AMD’s Helios AI Rack Challenges NVIDIA with HBM4 Memory Edge, Securing Microsoft as Customer; 2nm Process CPU Also Noted
TrendForce Taiwan Overview AMD's 'Helios AI Rack' is challenging NVIDIA's dominance in the AI market with its HBM4 memory advantage, securing Microsoft as a new key customer. The Helios rack is optimized for AI model training and inferen... -
TSMC Unveils Next-Gen ‘COUPE’ Silicon Photonics Platform for AI Optical Interconnect, Targeting 1.6 Tb/s Optical Engines by 2026
Tech Investments Taiwan Overview TSMC has announced 'COUPE,' a silicon photonics platform for co-packaged optics (CPO) in the AI era. COUPE innovatively stacks two dies—a photonic IC and an electronic IC—using SoIC bonding, placing the o... -
Sheen Technology Releases Optimal Thermal Adhesive Application Guide for Screw-Less AI Edge Sensors and EV Battery Designs
Sheen Technology China Overview Sheen Technology has published a detailed tutorial on optimal thermal adhesive application, addressing the growing trend of "screw-less" designs in AI edge sensors and EV battery monitors. In the 2026 elec... -
NVIDIA’s 2027 CoWoS Supply Forecast Raised 69% to 1.1 Million Interposers; AMD to See Over 50% Growth: KeyBanc Asia Supply Chain Checks Reveal Strong Demand
TipRanks USA Overview KeyBanc analyst John Vinh's Asia supply chain checks reveal strong, persistent demand across the semiconductor ecosystem. NVIDIA's 2027 CoWoS supply forecast for Rubin and Rubin Ultra was raised 69% to 1.1 million i... -
Morgan Stanley Forecasts 93% CoWoS Demand Surge by 2027, Driven by AMD’s Venice CPU Shipments
KuCoin International Overview Morgan Stanley forecasts global CoWoS (Chip-on-Wafer-on-Substrate) demand to nearly double to 2.694 million wafers in 2027, a 93% increase from 1.394 million in 2026. This growth is predominantly driven by A... -
Global ABF Substrate Shortage to Persist Through 2028 Due to Soaring AI Demand, Impacting High-End Chip Production
DigiTimes Taiwan Overview The global market for ABF (Ajinomoto Build-up Film) substrates is projected to remain in shortage through 2028, driven by escalating demand for AI hardware. This scarcity directly impacts the production of high-... -
Iceotope’s Precision Liquid Cooling Boosts AI Infrastructure Compute Density by Up to 6x for GPU/CPU Servers
Iceotope UK Overview Iceotope has developed precision immersion cooling technology specifically designed to address the high-density, power, and operational demands of modern AI infrastructure. This liquid cooling solution ensures stable... -
Morgan Stanley Forecasts 93% Surge in CoWoS Demand by 2027, Anticipates AMD Venice CPU Adoption
Phemex News USA Overview Morgan Stanley projects a staggering 93% surge in global demand for CoWoS (Chip-on-Wafer-on-Substrate) technology by 2027, reaching 2.694 million units. Nvidia is expected to remain the largest consumer, accounti... -
openPR.com Predicts AI Data Center Optical Interconnect Market to Reach $41.09 Billion by 2035, Driven by Intel’s Demonstrated Co-packaged Optics
openPR.com USA Overview This article provides an overview of a market research report published via openPR.com, forecasting the optical interconnect market in AI data centers to reach $41.09 billion by 2035. Growth is driven by increasin...
