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AI Workloads Drive Data Centers to Liquid Cooling, NVIDIA Optimizes Next-Gen Servers for Liquid Immersion
Connect CRE USA Overview The explosion of AI workloads is forcing data centers to adopt liquid cooling solutions as traditional air cooling can no longer manage the intense heat. Major data center providers like Equinix and Digital Realt... -
Microsoft Copilot+ PC Mandates Minimum 40 TOPS NPU, Redefining AI PC to Accelerate On-Device AI Processing
Layer3Labs USA Overview The definition of an AI PC is evolving, with the integration of Neural Processing Units (NPUs) to execute AI models directly on the device, rather than solely in the cloud, becoming a central requirement. Microsof... -
Dell Reports Record Q2 Revenue of $47 Billion with $95 Billion AI Server Backlog; Entire Supply Chain, Including DRAM, HBM, ABF Substrates, at ‘Redline’
KuCoin International Overview Dell reported record Q2 revenue of $47 billion and an impressive $95 billion backlog for AI servers. However, Dell executives stated that the entire supply chain, including DRAM, NAND, specific CPUs, mature ... -
Powertech Aims for Early 2027 Launch of World’s First AI Server Panel-Level Packaging Mass Production
Tonarism Taiwan Overview Powertech Technology, a leading Taiwanese OSAT, has unveiled plans to commence mass production of panel-level packaging (PLP) for AI semiconductors and server CPUs by early 2027. This initiative establishes the w... -
Intel Unveils Next-Gen Processors for Agentic AI at Hot Chips 2026: Featuring 256-Core Diamond Rapids CPU and Inference-Optimized Crescent Island GPU
TechRadar USA Overview Intel showcased its next-generation hardware architectures optimized for agentic AI workloads at Hot Chips 2026. The lineup includes the "Wildcat Lake Core Series 3 SoC" for client and edge devices, the "Crescent I... -
AT&S Ramps Up HPC Substrate Capacity to Meet Surging Data Center and AI Demand
Business Journal Austria Overview Austrian-based AT&S, a leading package substrate manufacturer, is significantly accelerating its IC substrate capacity expansion, primarily targeting high-performance computing (HPC) applications. Th... -
ABF Substrate Shortages Projected Through 2028 Amid AI Boom; Taiwanese, Japanese, Korean Manufacturers Secure Orders Until 2030
digitimes Taiwan Overview The global AI computing infrastructure boom is rapidly escalating demand for GPUs, CPUs, and ASICs, leading to projected ABF (Ajinomoto Build-up Film) substrate shortages starting in 2026 and worsening through 2... -
Nvidia and Groq AI Accelerators Boost AI Application Performance by up to 1000x, Expediting Next-Gen AI Model Development
Grooper USA Overview AI accelerators are high-performance hardware or software systems designed to dramatically speed up AI application processing. Leading chipmakers like Nvidia and Groq are manufacturing specialized hardware capable of... -
Ayar Labs Accelerates Commercial Deployment of Optical I/O Chiplets to Revolutionize AI/HPC Performance, Breaking Data Center Bottlenecks
Lightwave Online United States Overview Ayar Labs has announced new partnerships to accelerate the commercial deployment of its silicon photonics-based optical I/O chiplets. This technology directly integrates optical interconnects with ... -
NVIDIA to Unleash ‘Rubin’ AI Platform in 2026, Integrating Next-Gen GPU, CPU, and Networking Technologies
The Daily Star Bangladesh Overview NVIDIA has announced the 2026 release of 'Rubin,' its next-generation AI chip platform, designed to dramatically elevate AI performance through tightly integrated, advanced GPUs, CPUs, and networking ch...
