Die Attach Film– tag –
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New Technology
Henkel Unveils Loctite ABLESTIK CDF900 Series Conductive Die Attach Film with >8 W/m-K Thermal Conductivity for AI and HPC Packages
SpecialChem Germany Overview Henkel Adhesive Technologies has introduced the new Loctite ABLESTIK CDF900 series conductive die attach film (cDAF), revolutionizing advanced packaging for AI accelerators and HPC processors. This innovative... -
New Technology
Henkel Launches LOCTITE ABLESTIK CDF900 Series: Next-Gen Conductive Die Attach Film Achieving Over 8 W/m-K Thermal Conductivity for AI, 5G/6G, and HPC
Henkel Germany Overview Henkel Adhesive Technologies unveiled its LOCTITE ABLESTIK CDF900 series, a next-generation conductive die attach film (cDAF) offering thermal conductivity exceeding 8 W/m-K, at SEMICON Taiwan 2026. This advanced ... -
New Technology
Innox Advanced Materials Surpasses Previous Year’s SpaceX Revenue in Seven Months, Diversifies into AI Semiconductor and EV Battery Materials
BigGo Finance South Korea Overview Innox Advanced Materials, a Korean company, achieved a significant supply expansion to SpaceX, with cumulative revenue in the first seven months of 2026 surpassing the previous year's total. Beyond aero...
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