Epoxy Molding Compound– tag –
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Advanced Packaging Warpage Mitigation: Research Advances in Incorporating Negative Coefficient of Thermal Expansion Materials into Epoxy Molding Compounds and Underfills
Semiconductor Engineering USA Overview Active research is progressing on utilizing negative coefficient of thermal expansion (CTE) materials in epoxy molding compounds (EMC) and underfills to effectively mitigate warpage in large semicon... -
Apple Unveils 2nm iPhone 18; Samsung Cuts Thermal Resistance by 16% with Encapsulant and TIM Innovations, Intensifying Competition with TSMC
BigGo Finance South Korea Overview Following Apple's announcement of the 2nm iPhone 18, Samsung Electronics and TSMC are intensifying their competition in next-generation semiconductor packaging and thermal management. Samsung has achiev... -
Krayden Offers Low-Stress Green Epoxy Molding Compound LINQSOL EMC-7535 for High-Voltage, High-Power Semiconductors
Krayden USA Overview Krayden is offering LINQSOL EMC-7535, a green epoxy molding compound (EMC) engineered for high-voltage and high-power semiconductor devices. This material features low modulus for reduced stress, a high glass transit... -
SK hynix’s MR-MUF and Samsung’s TC-NCF Revolutionize Thermal Management in AI Semiconductor HBM: Driving Advanced Packaging Evolution
USD Analytics Global Overview The evolution of AI is driving significant changes in semiconductor packaging and High Bandwidth Memory (HBM) technologies, with SK hynix's Advanced MR-MUF and Samsung's TC-NCF technologies solving critical ... -
Sumitomo Bakelite Unveils Novel Low-Stress Epoxy Compound for Next-Gen 2.5D/3D Packaging
SEMI Europe Conference News Japan Overview Sumitomo Bakelite has announced a groundbreaking epoxy molding compound (EMC) at SEMI Europe, specifically engineered for the intricate demands of 2.5D and 3D advanced packaging solutions. This ... -
Henkel Unveils Advanced EMC to Tackle Warpage and Thermal Challenges in Next-Gen AI Processors
Henkel Corporate Press Release Germany Overview Henkel has introduced a novel epoxy molding compound (EMC) engineered specifically for high-performance AI and HPC processors. This innovative material significantly reduces thermal-induced... -
Sumitomo Bakelite Hits Record ¥305 Billion Sales, Riding High on AI Silicon Encapsulant Demand
The Shashi Japan Overview Sumitomo Bakelite Co., Ltd. has announced a record-high ¥305 billion ($2.0 billion USD) in consolidated sales for FY2025, primarily propelled by a robust recovery and growth in its encapsulant materials business... -
IDTechEx Analyzes Materials Shaping the Future of Advanced Semiconductor Packaging, Including 2.5D/3D Cu-Cu Hybrid Bonding and Glass Panel-Based Technologies
IDTechEx UK Overview This article is an overview of a market research report published by IDTechEx. IDTechEx's latest report focuses on materials shaping the future of advanced semiconductor packaging, including 2.5D and 3D Cu-Cu hybrid ... -
TrendForce Reports Samsung Files New HBM Dummy Die Patent to Enhance 16-Layer HBM5 Stack Reliability
TrendForce Taiwan Overview TrendForce reports that Samsung has filed a new HBM dummy die patent aimed at enhancing 16-layer HBM5 stack reliability. This patent seeks to address warpage and heat dissipation issues in high-stack configurat... -
Novel Low-CTE Epoxy Molding Compound Developed to Tackle Warpage in Large AI Semiconductors
Journal of Materials Science & Technology Global Overview Researchers have developed a novel low-coefficient of thermal expansion (CTE) epoxy molding compound specifically for encapsulating large dies such as HBM and AI semiconductors. T...
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