Epoxy Molding Compound– tag –
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AI Theme Propels Nikkei 225, Driving Significant Gains for Advanced Packaging Material Companies like Resonac and Mitsui Kinzoku
IG Japan Overview The latest Nikkei 225 analysis highlights the significant impact of the AI theme on the market, showing substantial gains for chemical manufacturers like Resonac, a global leader in advanced packaging materials and epox... -
PatSnap Eureka Report: Reducing Voiding in Chip Embedding Epoxies Critical for High-Reliability Systems in Automotive and Aerospace
PatSnap Eureka Global Overview A PatSnap Eureka report identifies reducing voiding in chip embedding epoxies as a critical reliability challenge in high-performance electronic packaging, particularly for automotive and aerospace systems.... -
Sumitomo Bakelite Develops G785 Series High-Tg Epoxy Molding Compounds with Industry-Leading 230°C Tg for Next-Gen SiC Power Modules
Sumitomo Bakelite Co., Ltd. Japan Overview Sumitomo Bakelite has developed the 'G785 Series' of high-Tg epoxy molding compounds for next-generation SiC power modules, achieving an industry-leading glass transition temperature (Tg) of 230... -
Alliance Chemical Report: Advanced Talc Applications Crucial for EV Battery Thermal Management and Power Electronics Reliability
Alliance Chemical USA Overview An Alliance Chemical report highlights that engineered talc grades are becoming critical in high-tech manufacturing, including EV battery thermal management and power electronics. In epoxy molding compounds... -
SemiMedia Reports China Accelerating Global Catch-Up in Advanced Packaging Materials for AI and HPC
SemiMedia China Overview A SemiMedia report indicates that China is accelerating its global catch-up in advanced packaging materials, driven by the demand for AI chips and high-performance computing (HPC). The focus is on developing high... -
Talc’s Multifunctional Role: Enhancing Performance in EV Batteries and Power Electronics
Alliance Chemical USA Overview Talc plays a crucial role in advanced technologies from EV batteries to power electronics. Talc-filled silicone or polyurethane gap pads serve as thermal interface materials in EV battery modules, providing... -
Sumitomo Bakelite Announces Price Increase for Semiconductor Encapsulation Epoxy Molding Compounds
住友ベークライト株式会社 Japan Overview Sumitomo Bakelite has announced a price revision for its SUMIKON™ EME series of epoxy resin molding compounds for semiconductor encapsulation, effective June 1, 2026, with increases ranging from 10...
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