Glass– tag –
-
Caelux Partners with Rayzon Solar and Navitas Solar for 10 GW Perovskite-Silicon Hybrid Tandem Module Manufacturing in India
PV Tech India Overview US perovskite solar technology firm Caelux has signed two five-year agreements with Indian solar manufacturers Navitas Solar and Rayzon Solar to produce a combined 10 GW of perovskite-silicon 'Hybrid Tandem' module... -
ACS Paper Unravels Glass Transition and Dynamic Behavior Balance in Epoxy-Anhydride Vitrimer Networks, Aiding Reprocessable Material Design
ACS Applied Polymer Materials USA Overview A detailed study in ACS Applied Polymer Materials investigates the intricate balance between glass transition temperature (Tg) and dynamic behavior in epoxy-anhydride vitrimer networks. The rese... -
New 230°C High-Heat-Resistant Epoxy Encapsulation Material (EME-G785 Series) Boosts SiC Power Module Applications and Thermal Performance
creating nano technologies inc. Japan Overview Creating Nano Technologies Inc. has introduced the EME-G785 series, a new epoxy encapsulation material with 230°C heat resistance, poised to expand applications for SiC power modules. This m... -
IDTechEx Analyzes Materials Shaping the Future of Advanced Semiconductor Packaging, Including 2.5D/3D Cu-Cu Hybrid Bonding and Glass Panel-Based Technologies
IDTechEx UK Overview This article is an overview of a market research report published by IDTechEx. IDTechEx's latest report focuses on materials shaping the future of advanced semiconductor packaging, including 2.5D and 3D Cu-Cu hybrid ... -
DELO Unveils PHOTOBOND SJ4192: A High-Performance Multi-Purpose Adhesive Primarily Composed of Bio-Based Components
DELO Press Release Germany Overview DELO has developed DELO PHOTOBOND SJ4192, a new multi-purpose adhesive primarily formulated from bio-based components, offering a unique combination of performance and sustainability. This adhesive del... -
Amkor Technology Presents Large Package Performance Evaluation of Glass Core Substrates for AI and HPC Applications at ECTC 2026
Amkor Technology South Korea Overview Amkor Technology's JongMin Park presented a technical poster on "Large Package Performance Evaluation of Glass Core Substrates for AI and HPC Applications" at ECTC 2026, a leading forum in electronic... -
PLANOPTIK Provides Customized Glass Wafers and Panels for MEMS and Photonics Applications, Enhancing Wafer-Level Packaging
planoptik ag Germany Overview German company planoptik ag offers customized glass wafers and panels specifically for wafer-level packaging (WLP) in MEMS devices and photonic applications. These products are crucial for protecting, encaps... -
NTU Researchers Develop Ultrathin Transparent Perovskite Solar Cells, 10,000 Times Thinner Than Human Hair
Tech Briefs Singapore Overview Researchers at Nanyang Technological University (NTU) in Singapore have developed ultrathin transparent perovskite solar cells, approximately 10,000 times thinner than a human hair and 50 times thinner than... -
DELO Unveils PHOTOBOND SJ4192: A Bio-Based Multi-Purpose Adhesive with Over 50% Sustainable Raw Materials and Exceptional Durability
Delo Germany Overview DELO has launched PHOTOBOND SJ4192, its first bio-based multi-purpose adhesive containing over 50% sustainable raw materials. This adhesive offers excellent humidity resistance, high flexibility, and robust peel str... -
Collaborative Research Unveils Recyclable Epoxy Adhesives for Wind Turbine Blades, Paving Way for Sustainable Wind Power
Renewable Energy Research Journal Global Overview Collaborative research on recyclable epoxy adhesives for bonding wind turbine blades has been announced. This study aims to significantly facilitate the dismantling and recycling of large...
