Key Findings: Creating Nano Technologies Develops EME-G785 Series, a 230°C High-Heat-Resistant Epoxy Encapsulation Material for SiC Power Modules, Expanding Applications with Industry-Leading Performance
Creating Nano Technologies Inc. has announced the development of the ‘EME-G785 series,’ an epoxy encapsulation material featuring exceptionally high heat resistance, specifically engineered for next-generation silicon carbide (SiC) power modules. This innovative material achieves a glass transition temperature (Tg) of 230°C, an industry-leading figure for epoxy resin encapsulants, and maintains superior electrical and mechanical properties even under extreme high-temperature operating conditions. This breakthrough is expected to maximize the performance of SiC power modules and substantially expand their application fields.
Technical & Business Details
- Industry-Leading Heat Resistance: The EME-G785 series overcomes the heat resistance limitations of many conventional epoxy encapsulants by achieving an impressively high Tg of 230°C. This elevated heat resistance is critical for accommodating the higher junction temperatures of SiC power modules and ensuring their long-term reliability.
- Superior Property Retention: Even in high-temperature environments, the material consistently maintains crucial properties such as electrical insulation, mechanical strength, moisture resistance, and thermal cycle stability. This minimizes the risk of performance degradation or failure, even when power modules are exposed to harsh operating conditions.
- Compatibility with Soldering Processes: This encapsulant is compatible with soldering processes—typically conducted above 200°C—used for connecting SiC chips to heat sinks or sintered materials in power module assembly. This enhances manufacturing process flexibility and contributes to improved yields.
- Enabling Advanced SiC Power Modules: High-heat-resistant encapsulants like the EME-G785 series facilitate higher power density, miniaturization, and enhanced reliability for SiC power modules. This, in turn, enables their application in a broader range of high-efficiency applications, including electric vehicles (EVs), industrial motor drives, and renewable energy systems.
Background & Industry Context
SiC power semiconductors are rapidly gaining adoption in EV inverters, industrial equipment, and renewable energy sectors due to their superior low-loss characteristics. However, SiC devices can operate at significantly higher junction temperatures than silicon (Si) devices, making the development of packaging materials, particularly encapsulants, capable of withstanding these extreme temperatures an urgent challenge. Traditional encapsulants have historically faced issues with degradation and reliability loss at elevated temperatures.
Strategic Significance & Outlook
The introduction of innovative high-heat-resistant epoxy encapsulants like the EME-G785 series unlocks the full potential of SiC power modules, expanding design freedom and creating new market opportunities. This is expected to significantly contribute to improving energy efficiency across society, enabling longer EV ranges, faster charging times, and higher efficiency in renewable energy systems. This Japanese materials technology is poised to be a powerful driver in the global power electronics industry’s advancement.
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