GPU– tag –
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Hot Chips 2026: OpenAI Unveils ‘Jalapeño’ AI ASIC, Claiming 30% Efficiency & Throughput Gains Over Nvidia Blackwell
Tom's Hardware USA Overview At Hot Chips 2026, OpenAI unveiled 'Jalapeño,' an AI-developed custom AI ASIC, claiming up to 30% efficiency and throughput improvements over Nvidia's high-performance Blackwell GPUs. Jalapeño utilizes a NUMA-... -
Sumitomo Bakelite Unveils Novel Low-Stress Epoxy Compound for Next-Gen 2.5D/3D Packaging
SEMI Europe Conference News Japan Overview Sumitomo Bakelite has announced a groundbreaking epoxy molding compound (EMC) at SEMI Europe, specifically engineered for the intricate demands of 2.5D and 3D advanced packaging solutions. This ... -
Henkel Launches LOCTITE ABLESTIK CDF900 Conductive Die Attach Film with Over 8 W/m-K Thermal Conductivity for High-Power AI Packages
Henkel Germany Overview Henkel has introduced the LOCTITE ABLESTIK CDF900 series conductive die attach film to address thermal management challenges in high-power AI packages. This new product significantly boosts thermal conductivity to... -
Morgan Stanley Taps Samsung Electro-Mechanics as Top Korean Tech Pick Amid Surging AI Chip Substrate Demand
Evrim Ağacı Turkey Overview Morgan Stanley has elevated Samsung Electro-Mechanics to its premier Korean tech stock, citing the escalating technical demands of AI chip designs on advanced substrates. As AI processors become larger, multi-... -
TSMC CoWoS and ABF Substrate Supply Bottlenecks Threaten AI Chip Production Amid $265B Market Opportunity
Silicon To Software USA Overview For leading AI accelerators, wafer manufacturing capacity is not the only constraint; CoWoS advanced packaging and ABF (Ajinomoto Build-up Film) substrate qualification cycles are also limiting production... -
ABF Substrate Shortages Projected Through 2028 Amid AI Boom; Taiwanese, Japanese, Korean Manufacturers Secure Orders Until 2030
digitimes Taiwan Overview The global AI computing infrastructure boom is rapidly escalating demand for GPUs, CPUs, and ASICs, leading to projected ABF (Ajinomoto Build-up Film) substrate shortages starting in 2026 and worsening through 2... -
Wingspire Equipment Finance Provides $140 Million Financing for High-Performance AI Compute Infrastructure Expansion
Business Wire USA Overview Wingspire Equipment Finance has provided $140 million in equipment financing to a private equity-backed firm delivering GPU cloud computing capabilities to AI labs and enterprises. This funding is dedicated to ... -
Blueprint for 100 kW+ GPU Cluster AI Data Centers Released: Liquid Cooling Becomes Indispensable
Soeteck USA Overview A practical blueprint for designing AI data centers to support high-density GPU clusters, exceeding 100 kW per rack with NVIDIA GB300-class deployments, has been unveiled. The report underscores that traditional data... -
AI Data Center Boom Fuels Power & Cooling Infrastructure Investment, Liquid Cooling Market to Hit $23.23 Billion by 2035
DataM Intelligence India Overview The surging demand for AI is reshaping the industrial equipment supply chain, driving significant investment in data center power and cooling infrastructure. Manufacturers of generators, electrical syste... -
AI Workloads Fundamentally Reshaping Data Center Power Demand and Infrastructure, IEA Projects Doubled Consumption by 2030
Data Center Dynamics UK Overview AI workloads are profoundly altering data center power demand and infrastructure planning, driven by concentrated compute, heat, and electrical loads per rack. High-power GPUs in AI training clusters nece...
