GPU– tag –
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Nvidia Dominates H1 2026 AI Chip Market with 75-81% Revenue Share, While AMD and Intel Gain Momentum with OpenAI Partnership and New GPU Sampling
The Motley Fool USA Overview Nvidia retained a dominant 75-81% revenue share in the AI accelerator market during the first half of 2026. However, AMD is strengthening its position through a strategic partnership with OpenAI, and Intel is... -
Mobile Edge AI Advances Significantly in 2026: Enhancing On-Device Inference, Battery Efficiency, and Privacy Protection
The Backend Developers Unknown Overview In 2026, edge AI on mobile devices has achieved significant advancements in on-device inference, battery efficiency, and privacy protection. Optimized mapping of AI operators to dedicated NPUs and ... -
NVIDIA to Unleash ‘Rubin’ AI Platform in 2026, Integrating Next-Gen GPU, CPU, and Networking Technologies
The Daily Star Bangladesh Overview NVIDIA has announced the 2026 release of 'Rubin,' its next-generation AI chip platform, designed to dramatically elevate AI performance through tightly integrated, advanced GPUs, CPUs, and networking ch... -
SK hynix Unveils $4 Billion Indiana HBM Plant, Bolstering U.S. Semiconductor Packaging and AI Supply Chains
Silicon Analysts USA Overview SK hynix has announced a significant $4 billion investment to establish an advanced High-Bandwidth Memory (HBM) packaging facility in Indiana, USA, with mass production slated for late 2028. This strategic m... -
Powertech and Broadcom Launch $400M Singapore Joint Venture to Expand FOPLP Manufacturing for AI ASICs
Taipei Times Taiwan Overview Powertech Technology has approved a $400 million joint venture with Broadcom in Singapore to establish advanced Panel-Level Packaging (PLP) manufacturing capabilities, focusing on additive fine-line RDL techn... -
AMD’s Helios AI Rack Challenges NVIDIA with HBM4 Memory Edge, Securing Microsoft as Customer; 2nm Process CPU Also Noted
TrendForce Taiwan Overview AMD's 'Helios AI Rack' is challenging NVIDIA's dominance in the AI market with its HBM4 memory advantage, securing Microsoft as a new key customer. The Helios rack is optimized for AI model training and inferen... -
HBM4 Competition Shifts to Cooling Technology Amid Hybrid Bonding Delays and Nvidia’s Next-Gen GPU Trends
DigiTimes Taiwan Overview Industry experts note that the focus of competition in the 6th-generation High-Bandwidth Memory (HBM4) market is shifting towards cooling technology, against the backdrop of delays in hybrid bonding adoption. HB... -
HBM Shortage Accelerates ‘Chipflation,’ TrendForce Forecasts New Normal Driven by Unabating AI Demand
The Korea Economic Daily South Korea Overview Surging AI infrastructure demand is driving up memory chip prices, straining cloud providers' profit margins. Market research firm TrendForce predicts that the HBM (High-Bandwidth Memory) sho... -
Nvidia Secures $1.5 Billion Advanced Packaging Deal with Amkor, Diversifying Supply Chain and Easing TSMC CoWoS Bottlenecks
TradingKey USA Overview Nvidia and Amkor Technology have signed a multi-year packaging services agreement valued at approximately $1.5 billion. This pivotal deal is a strategic move for Nvidia to reduce its reliance on TSMC's CoWoS packa... -
Samsung Delays Hybrid Bonding HBM Mass Production to 2029-2030, Aligning with Technical Challenges and NVIDIA’s Next-Gen GPUs
TrendForce South Korea Overview Samsung Electronics is reportedly delaying the full-scale mass production of its hybrid bonding technology for next-generation HBM and logic semiconductors until 2029-2030. The company is currently buildin...
