Heat Sink– tag –
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New Technology
CTX Thermal Solutions Expands TIM Portfolio with Thermal Pads, Graphite Foils for 5G, EV, and Medical Applications
SJN (Semiconductor Journal Network) USA Overview CTX Thermal Solutions has expanded its Thermal Interface Material (TIM) portfolio to enhance heat dissipation efficiency in electronic components, addressing thermal management challenges ... -
New Technology
3M Supplies 5590H Thermally Conductive Acrylic Interface Pad for IC Chips and EV Batteries
Facebook (3M) USA Overview 3M is supplying its 5590H Thermally Conductive Acrylic Interface Pad, designed to provide an efficient heat transfer path between high-heat-generating components like IC chips and EV batteries, and their respec... -
New Technology
New 230°C High-Heat-Resistant Epoxy Encapsulation Material (EME-G785 Series) Boosts SiC Power Module Applications and Thermal Performance
creating nano technologies inc. Japan Overview Creating Nano Technologies Inc. has introduced the EME-G785 series, a new epoxy encapsulation material with 230°C heat resistance, poised to expand applications for SiC power modules. This m...
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