Ibiden– tag –
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AI Accelerator ABF Substrate Shortage to Exceed 40% by 2028; Ibiden, Unimicron, Samsung Electro-Mechanics Rush Billions in Capacity Expansion
Tom's Hardware Japan Overview The supply shortage of ABF (Ajinomoto Build-up Film) substrates for AI accelerators is projected to worsen significantly, potentially reaching approximately 10% by late 2026, 21% by 2027, and over 40% by 202... -
Korean Tech Giants Accelerate AI Substrate Production Amid Soaring Demand, Nearing 90% Utilization
TrendForce Taiwan Overview The proliferation of AI data centers has created a critical shortage and driven up prices for advanced substrates essential for GPUs and HBM. In response, Samsung Electro-Mechanics (SEM) and LG Innotek are aggr... -
Ibiden Announces Significant Yield Improvement in AI Chip ABF Substrates with New Process Technology, Stabilizing Supply
Nikkei Asia Japan Overview Ibiden has reported a substantial improvement in manufacturing yield for Ajinomoto Build-up Film (ABF) substrates used in AI processors, driven by the introduction of a new process technology. This advancement ... -
ABF Substrate Shortages Projected Through 2028 Amid AI Boom; Taiwanese, Japanese, Korean Manufacturers Secure Orders Until 2030
digitimes Taiwan Overview The global AI computing infrastructure boom is rapidly escalating demand for GPUs, CPUs, and ASICs, leading to projected ABF (Ajinomoto Build-up Film) substrate shortages starting in 2026 and worsening through 2... -
Ibiden Commits ¥500 Billion to ABF Substrates for AI Servers, Anticipating Supply Crunch Beyond 2028
MK Japan Overview Ibiden, the world's leading AI substrate manufacturer, announced a ¥500 billion investment from this year to 2028 to expand production capacity for IC package substrates for AI and high-performance servers. Despite long... -
Advanced Package Substrate Market Heats Up: Ibiden Leads with $3.2 Billion Investment, Samsung Electro-Mechanics Challenges with Glass Substrates, Technical Hurdles Emerge
MK Japan Overview The package substrate market, crucial for AI semiconductor performance, is intensifying with major investments and technological competition. Japan's Ibiden maintains dominant leadership with ~35% market share, investin... -
Samsung Electro-Mechanics Challenges Ibiden in AI Server Package Substrates with FC-BGA and Glass Substrate Push
MK South Korea Overview Samsung Electro-Mechanics is aggressively challenging Ibiden's dominant market share in AI package substrates by enhancing its Flip-Chip Ball Grid Array (FC-BGA) and next-generation glass substrate technologies fo... -
AT&S to Invest €1.5-2 Billion in Malaysian ABF Capacity, While IBIDEN Allocates ¥500 Billion for AI/HPC Substrate Expansion in Japan & Overseas
Sector Signals China Overview AT&S has agreed with AMD and another major tech firm to expand high-end IC substrate capacity for AI/HPC, planning a €1.5-2 billion investment in its Kulim, Malaysia plant, fully supported by long-term c... -
TSMC and NVIDIA’s ‘Glass Killer’: How Glass Core Substrates Will Revolutionize AI Chips by 2028
SETN Taiwan Overview Renowned analyst Kuo Ming-Chi reveals TSMC's secretive development of 'glass core substrates' in collaboration with NVIDIA, poised to be a game-changer for next-generation AI chip manufacturing. This innovative techn... -
AI-Driven Advanced Packaging Orders Surge, Widening ABF Carrier Board Supply-Demand Gap, Benefiting Industry with Both Volume and Price Increases
AlphaWire International Overview Nomura Securities reports the semiconductor packaging substrate industry is experiencing a strong AI-driven recovery, with global packaging substrate shipments up 36% year-on-year in June 2026. This growt...
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