Interconnect– tag –
-
Sn-Coated Cu Solder Paste via Transient Liquid Phase Bonding Offers High-Reliability for Power Device Packaging
MDPI Switzerland Overview This MDPI paper reports on the potential of Sn-coated Cu solder paste for power device packaging using Transient Liquid Phase Bonding (TLPB). While Cu offers excellent electrical and thermal conductivity, its ox... -
CTE-Gradient Interconnect Technology Drastically Reduces Thermal Cycling Damage in SiC Inverters
PatSnap Eureka USA Overview PatSnap Eureka reveals an innovative approach to mitigate thermal cycling damage in SiC power inverter modules by creating biomimetic interconnects with a Coefficient of Thermal Expansion (CTE) gradient. This ...
12