Master Bond– tag –
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Master Bond Offers Low-Stress, Low-Outgassing, Fast-Curing Glob Top Epoxy Compounds for Semiconductor Chip and Wire Bond Protection
Master Bond Inc. USA Overview Master Bond is supplying high-performance glob top epoxy compounds for the encapsulation of semiconductor chips and wire bonds in chip-on-board (COB) applications. These formulations provide effective protec... -
Master Bond Announces EP30LTE-2, a Two-Part Epoxy System Achieving Ultra-Low CTE (10-13 x 10^-6 in/in/°C) and High Dimensional Stability for Aerospace, Optical, and Electronic Industries
Master Bond Inc. USA Overview Master Bond has launched EP30LTE-2, a groundbreaking two-part epoxy system characterized by an exceptionally low coefficient of thermal expansion (CTE) of 10-13 x 10^-6 in/in/°C, coupled with outstanding dim... -
Master Bond Offers Heat-Curable and Biocompatible Epoxy Adhesive Systems Optimized for Polyimide Bonding in Semiconductor, Aerospace, and Medical Devices
Master Bond Inc. USA Overview Master Bond provides high-performance epoxy adhesive systems specifically engineered for bonding polyimide plastics to themselves and to dissimilar substrates, leveraging polyimide's superior thermal stabili... -
Master Bond Unveils Dimensionally Stable Epoxy Adhesive Systems Achieving Low Shrinkage and Ultra-Low CTE for Semiconductor and Optoelectronic Packaging
Master Bond Inc. USA Overview Master Bond has introduced dimensionally stable epoxy adhesive systems specifically engineered for semiconductor assembly, optoelectronic packaging, and high-voltage sensor potting applications. These system... -
Master Bond Introduces Flexible Pouches and Disposable Cartridges for Epoxy Adhesives, Silicones, and UV Cure Products to Boost Productivity and Reliability
Master Bond Inc. USA Overview Master Bond has launched new packaging solutions, including flexible pouches and disposable cartridges, for its epoxy adhesives, silicones, and UV cure systems. These innovations are designed to maximize pro... -
Master Bond Launches New Epoxy Adhesives EP37-3FLF and EP5TC-80, Enhancing EV Battery Assembly Structural Integrity and Thermal Management
MasterBond.com USA Overview Master Bond has released two new epoxy products, EP37-3FLF and EP5TC-80, specifically optimized for electric vehicle (EV) battery assembly, significantly improving performance and reliability. EP37-3FLF is a h... -
Master Bond Offers Advanced Adhesives, Sealants & Coatings for R&D, Meeting NASA Low Outgassing & USP Class VI Standards
Master Bond USA Overview Master Bond is providing a wide range of advanced adhesive, sealant, and coating formulations for Research & Development (R&D) applications, meeting rigorous certifications such as NASA low outgassing, US... -
Master Bond Introduces EP62-1LPSPMed, an Ultra-Low Viscosity Epoxy for Medical Devices with ISO 10993-5 and USP Class VI Compliance
Master Bond USA Overview Master Bond has launched EP62-1LPSPMed, an ultra-low viscosity, two-part epoxy system that has successfully passed biocompatibility testing (ISO 10993-5 and USP Class VI) for medical device applications. This mat... -
Master Bond Offers Eco-Friendly Solvent-Free, Halogen-Free, RoHS-Compliant Adhesive and Encapsulation Solutions
Master Bond USA Overview Master Bond offers a wide range of solvent-free, halogen-free, RoHS-compliant, and energy-efficient adhesives, sealants, coatings, potting, and encapsulation compounds, emphasizing reduced environmental impact. N... -
Master Bond Offers High-Strength, High-Reliability Die Attach Epoxy Adhesives for Microelectronics
Master Bond USA Overview Master Bond provides die attach epoxy adhesives for microelectronic semiconductor packaging and chip-on-board assemblies, featuring high bond strength, thermal cycling resistance, mechanical shock/vibration resis...
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