Master Bond Offers Low-Stress, Low-Outgassing, Fast-Curing Glob Top Epoxy Compounds for Semiconductor Chip and Wire Bond Protection

September 6, 2026

Master Bond Inc. USA

Overview

Master Bond is supplying high-performance glob top epoxy compounds for the encapsulation of semiconductor chips and wire bonds in chip-on-board (COB) applications. These formulations provide effective protection against moisture, chemicals, and contaminants, while minimizing thermal mismatch and offering mechanical support with electrical insulation. Available as one and two-component epoxies and UV-curing systems, their low stress, low outgassing, and fast cure speeds significantly enhance the reliability and durability of electronic devices.

In Depth

Key Findings

Master Bond has announced the availability of high-performance glob top epoxy compounds, essential for enhancing the reliability of electronic devices utilizing Chip-on-Board (COB) technology. These specialized formulations effectively protect semiconductor chips and wire bonds from moisture, chemicals, mechanical stress, and contaminants. Key attributes include low stress, low outgassing, and fast cure speeds, which not only boost production efficiency but also minimize damage from thermal mismatch to sensitive electronic components, thereby ensuring long-term performance and durability of devices.

Technical / Product Details

Glob top epoxies are protective materials applied over bare semiconductor dies directly mounted on a substrate. Master Bond’s glob top epoxy systems feature the following technical characteristics:

Superior Protection: Once cured, they form a robust barrier against moisture, chemicals, ionic contaminants, and mechanical shock. This reduces device failure rates and enables operation in harsh environments.
Low Stress Properties: Designed with minimal cure shrinkage and a coefficient of thermal expansion (CTE) closely matching that of the chip and substrate, they dramatically reduce thermal stresses caused by temperature changes. This is crucial for preventing thermal mismatch-induced failures such as wire bond breaks or chip cracking.
Low Outgassing: Specific products meet NASA’s low outgassing specifications (ASTM E595), making them suitable for vacuum environments and sealed electronic enclosures. Suppressing the release of volatile components prevents contamination of adjacent sensitive optical or electronic parts.
Fast Cure Speed: To enhance production line throughput, both UV-curable glob tops and epoxies capable of low-temperature thermal curing are offered. This contributes to reduced manufacturing time and cost.
Electrical Insulation: Once cured, they become excellent electrical insulators, preventing short circuits between wire bonds and ensuring stable circuit operation.

Master Bond provides various glob top material formulations, including one-component epoxies, two-component epoxies, and UV-curing systems, allowing selection based on specific application requirements (e.g., workability, curing conditions, final performance).

Background & Context

The miniaturization and performance enhancement of electronic devices have driven significant advancements in semiconductor packaging technology. COB technology is a critical method for minimizing footprint and improving electrical performance, but it simultaneously introduces new challenges in protecting bare chips and wire bonds from the external environment. Glob top materials have been widely adopted as a cost-effective and reliable solution to this challenge. Their importance is increasing in fields requiring high reliability and space efficiency, such as automotive, consumer electronics, medical, and industrial control systems.

Strategic Significance & Outlook

The glob top epoxy market is projected for steady growth, driven by the proliferation of IoT devices, advancements in wearable technology, increasing electronic control in automobiles, and the high integration of 5G/6G communication modules. Adhesive manufacturers like Master Bond will focus on developing glob top materials with even better thermal management properties (e.g., higher thermal conductivity), lower CTEs, and faster, lower-energy curing methods. Furthermore, in response to tightening environmental regulations, the development of VOC-free and halogen-free products is also expected. These advancements will be key to further improving the performance, reliability, and manufacturing efficiency of future electronic devices.

Source: https://www.masterbond.com/industries/glob-top-epoxies

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