NIC– tag –
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Linear Pluggable Optics (LPO) Redefines FEC Implementation, Reducing DSP Dependence in High-Speed Optical Networks
C-LIGHT China Overview Linear Pluggable Optics (LPO) significantly reduces or eliminates conventional Digital Signal Processor (DSP) functionality from optical modules, shifting signal processing responsibilities to the host system. Whil... -
FS Expands AI Optics Portfolio from 1.6T Scale-Out to 800G Scale-Across, Supporting Next-Gen AI Fabrics
Converge Digest Unknown Overview FS has significantly extended its optical connectivity portfolio for AI infrastructure, now offering 400G, 800G, and 1.6T optical transceivers for scale-out networks. Additionally, the company provides 40... -
Marvell Unveils Photonic Fabric Products Post-Celestial AI Acquisition, Fortifying AI Memory Infrastructure
Technologies.org USA Overview Following its acquisition of Celestial AI in February 2026, Marvell has launched new AI memory infrastructure products, including Photonic Fabric memory modules, NICs, and chiplets. These offerings aim to bo... -
Japanese Consortium Launches Distributed AI Processing Infrastructure Trial Linked to KYOJO CUP, Utilizing All-Photonics Network over Power Grid Fiber
IBTimes JP Japan Overview A consortium including Nautilus Technologies, IIJ, TEPCO Power Grid, Chubu Electric Power Grid, Fujitsu, and 1FINITY has initiated a demonstration project for next-generation distributed AI processing infrastruc... -
Lightmatter Unveils Liquid-Cooled Laser NIC, “Guide DR,” Quadrupling Data Center Rack Density for AI/HPC
Lightmatter Press Release USA Overview Lightmatter has introduced "Guide DR," the industry's first liquid-cooled laser Network Interface Card (NIC), designed to dramatically increase optical connectivity efficiency and bandwidth density ... -
Lightmatter Unveils Liquid-Cooled Guide DR Laser NIC, Quadrupling Rack Density for AI Clusters
Lightmatter USA Overview Lightmatter announced Guide® DR, an industry-first liquid-cooled Laser Network Interface Card (LNIC) in an OCP NIC 3.0 form factor, designed to quadruple rack density. This innovation relocates the high-density l...
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