NVIDIA– tag –
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Qualcomm and Amazon Forge Strategic Partnership for Custom AI Chips, Amazon Secures Warrants Tied to $60 Billion Purchase Agreement
BigGo Finance USA Overview Qualcomm and Amazon have announced a multi-generational strategic partnership to jointly develop custom AI inference chips and optical interconnect solutions for AI data centers. The agreement includes Qualcomm... -
NVIDIA Develops 45°C Liquid Cooling System for Next-Gen Rubin AI Infrastructure, Enhancing Data Center Energy Efficiency
Facebook (NVIDIA Official) USA Overview NVIDIA has developed an innovative liquid cooling system for its next-generation Rubin AI infrastructure, capable of using heated liquid up to 45°C (113°F). This direct liquid cooling (DLC) system ... -
AI Accelerates Drug Discovery & Science: Anthropic and Meta Deploy Supercomputers and Multi-Agent Systems for Real-World Research
AI Weekly Global Overview AI is transitioning from theoretical publications to operational infrastructure, dramatically accelerating drug discovery and scientific research. Anthropic reported success rates exceeding the industry average ... -
Qualcomm Partners with Amazon to Expand AI Infrastructure Presence, Projecting $15 Billion Data Center Revenue by 2029 and Intensifying Competition with Nvidia
Facebook (Barrons) USA Overview Nvidia's stock slipped after Qualcomm announced an AI infrastructure deal with Amazon, highlighting intensifying competition in the AI semiconductor market. Qualcomm plans to manufacture multi-generational... -
Mistral AI Secures €3 Billion in Samsung Electronics-Led Round, Valuation Soars Past €21 Billion, Forges Semiconductor AI Partnership
The Korea Herald South Korea Overview French AI startup Mistral AI raised €3 billion (approximately $3.5 billion) in a funding round led by Samsung Electronics and EQT’s Scale-Up Europe Fund, pushing its valuation beyond €21 billion. Thi... -
Amkor Technology and NVIDIA Announce $1.5 Billion Advanced Packaging Partnership to Accelerate AI Multi-Die Integration
IMAPS 3D InCites Content Platform USA Overview Amkor Technology and NVIDIA announced a multi-year partnership in July 2026, including a $1.5 billion advanced packaging and development agreement, to drive next-generation technology for AI... -
TSMC SVP Reports 90% Surge in Equipment Orders in Six Months Driven by AI Demand: Equivalent to Building 20 Fabs Globally Simultaneously
TechSoda Taiwan Overview TSMC Senior VP Cliff Hou reported an astonishing 90% surge in equipment orders over six months, driven by AI demand far exceeding forecasts, equivalent to constructing nearly 20 fabs worldwide simultaneously. Uni... -
AI Supply Chain Maxed Out: 40-Week Lead Times Become New Normal as HBM Emerges as Primary Bottleneck Over TSMC CoWoS
Markets Insider USA Overview The AI supply chain faces severe constraints, with 40-week lead times becoming the new norm. High Bandwidth Memory (HBM) has replaced TSMC's CoWoS advanced packaging as the primary bottleneck, driven by NVIDI... -
Taiwan’s OSATs Boost AI Capacity with $14.4B Capex; ASE Deepens TSMC CoWoS Collaboration to Meet Soaring Demand
Domino Theory Taiwan Overview Five leading Taiwanese chip packaging and test companies plan a record $14.4 billion (NT$460 billion) in capital expenditures this year to meet surging AI chip demand, matching TSMC's own advanced packaging ... -
TSMC CoWoS Capacity Expands 9X in 3 Years, Yet 10% AI Chip Shortage Persists with NVIDIA Securing 60%
XenoSpectrum Taiwan Overview TSMC's CoWoS advanced packaging capacity has surged nine-fold over three years, but a 10% supply shortage for AI chips remains due to soaring demand. NVIDIA currently secures approximately 60% of TSMC's CoWoS...
